Abstract
Theoretical and experimental data on the effect of additions of micro- and nanosized solid particles on the thermal conductivity of liquid media (nanofluids) are considered. According to theoretical calculations, a manifold increase in the thermal conductivity is possible only for resting media in which percolation structures are formed from the modifier nanoparticles, whereas in the case of the coolant circulation and/or random distribution of particles in its volume the increase in the thermal conductivity cannot increase several tens of percents. The primary factors for increasing the thermal conductivity are high volume fraction of particles and isotropicity of their properties, whereas the specific thermal conductivity of the particle material is not a key factor. The available experimental data were obtained using different measurement methods and different dispersions whose structure was not duly controlled. Therefore, the data are characterized by large scatter, which does not allow unambiguous identification of the acting averaging law, although the majority of data are characterized by positive deviation from Maxwell’s law. On the other hand, the available data do not exceed the values expected on the basis of the rule of logarithmic additivity of the component thermal conductivities.
Similar content being viewed by others
Notes
Publication permission of October 2, 2020, © 1958 American Chemical Society.
Publication permission of October 2, 2020, © 2007 Elsevier.
REFERENCES
Levenspiel, O., Engineering Flow and Heat Exchange, New York: Springer, 2014, pp. 179–208.
Faghri, A. and Zhang, Y., Fundamentals of Multiphase Heat Transfer and Flow, Berlin: Springer, 2020.
Maxwell, J.C., A Treatise on Electricity and Magnetism, Oxford (UK): Clarendon, 1881, vol. 1.
Das, S.K., Choi, S.U.S., and Patel, H.E., Heat Transfer Eng., 2006, vol. 27, no. 10, pp. 3–19. https://doi.org/10.1080/01457630600904593
Choi, S.U.S. and Eastman, J.A., in Int. Mechanical Engineering Congr. and Exhibition, San Francisco, CA (USA), Nov. 12–17, 1995.
Lee, S., Choi, S.U.S., Li, S., and Eastman, J.A., J. Heat Transfer, 1999, vol. 121, no. 2, pp. 280–289. https://doi.org/10.1115/1.2825978
Eastman, J.A., Choi, S.U.S., Li, S., Yu, W., and Thompson, L.J., Appl. Phys. Lett., 2001, vol. 78, no. 6, pp. 718–720. https://doi.org/10.1063/1.1341218
Xuan, Y. and Li, Q., Int. J. Heat Fluid Flow, 2000, vol. 21, no. 1, pp. 58–64. https://doi.org/10.1016/S0142-727X(99)00067-3
Choi, S.U.S., Zhang, Z.G., Lockwood, F.E., and Grulke, E.A., Appl. Phys. Lett., 2001, vol. 79, no. 14, pp. 2252–2254. https://doi.org/10.1063/1.1408272
Choi, S.U.S., Zhang, Z.G., and Keblinski, P., Encycl. Nanosci. Nanotechnol., 2004, vol. 6, pp. 757–773.
Zussman, S., in Technol. Transfer Highlights, Argonne National Laboratory (USA), 1997, vol. 8, p. 4
Yu, W., France, D.M., Routbort, J.L., and Choi, S.U.S., Heat Transfer Eng., 2008, vol. 29, no. 5, pp. 432–460. https://doi.org/10.1080/01457630701850851
Devendiran, D.K. and Amirtham, V.A., Renew. Sustain. Energy Rev., 2016, vol. 60, pp. 21–40. https://doi.org/10.1016/j.rser.2016.01.055
Jabbari, F., Rajabpour, A., and Saedodin, S., Chem. Eng. Sci., 2017, vol. 174, pp. 67–81. https://doi.org/10.1016/j.ces.2017.08.034
Ganvir, R.B., Walke, P.V., and Kriplani, V.M., Renew. Sustain. Energy Rev., 2017, vol. 75, pp. 451–460. https://doi.org/10.1016/j.rser.2016.11.010
Ahmadi, M.H., Mirlohi, A., Nazari, M.A., and Ghasempour, R., J. Mol. Liq., 2018, vol. 265, pp. 181–188. https://doi.org/10.1016/j.molliq.2018.05.124
Sajid, M.U. and Ali, H.M., Int. J. Heat Mass Transfer, 2018, vol. 126, pp. 211–234. https://doi.org/10.1016/j.ijheatmasstransfer.2018.05.021
Sajid, M.U. and Ali, H.M., Renew. Sustain. Energy Rev., 2019, vol. 103, pp. 556–592. https://doi.org/10.1016/j.rser.2018.12.057
Simpson, S., Schelfhout, A., Golden, C., and Vafaei, S., Appl. Sci., 2019, vol. 9, no. 1, pp. 87–142. https://doi.org/10.3390/app9010087
Sezer, N., Atieh, M.A., and Koç, M., Powder Technol., 2019, vol. 344, pp. 404–431. https://doi.org/10.1016/j.powtec.2018.12.016
Yang, L., Ji, W., Huang, J.N., and Xu, G., J. Mol. Liq., 2019, vol. 296, ID 111780. https://doi.org/10.1016/j.molliq.2019.111780
Maxwell, J.C., A Treatise on Electricity and Magnetism, Cambridge: Oxford Univ. Press, 1904.
von Bruggeman, D.A.G., Ann. Phys. (Berlin), 1935, vol. 416, no. 7, pp. 636–664. https://doi.org/10.1002/andp.19354160705
Hamilton, R.L. and Crosser, O.K., Ind. Eng. Chem. Fundam., 1962, vol. 1, no. 3, pp. 187–191. https://doi.org/10.1021/i160003a005
Rayleigh, L., Philos. Mag., 1892, vol. 34, no. 211, pp. 481–502. https://doi.org/10.1017/CBO9780511703997.005
Schwan, H.P., Schwarz, G., Maczuk, J., and Pauly, H., J. Phys. Chem., 1962, vol. 66, no. 12, pp. 2626–2635. https://doi.org/10.1021/j100818a066
Lu, S.-Y. and Song, J.-L., J. Appl. Phys. (Melville, NY), 1996, vol. 79, no. 2, pp. 609–618. https://doi.org/10.1063/1.360803
Xue, Q., J. Mater. Sci. Technol. (Shenyang), 2000, vol. 16, pp. 367–369.
Hasselman, D.P.H. and Johnson, L.F., J. Compos. Mater., 1987, vol. 21, no. 6, pp. 508–515. https://doi.org/10.1177/002199838702100602
Gitterman, M., Phys. Rev. E, 1995, vol. 52, no. 1, pp. 303–306. https://doi.org/10.1103/PhysRevE.52.303
Wojnar, R., Acta Phys. Pol. B, 2001, vol. 32, no. 2, pp. 333–349.
Jang, S.P. and Choi, S.U.S., Appl. Phys. Lett., 2004, vol. 84, no. 21, pp. 4316–4318. https://doi.org/10.1063/1.1756684
Wang, X., Xu, X., and Choi, S.U.S., J. Thermophys. Heat Transfer, 1999, vol. 13, no. 4, pp. 474–480. https://doi.org/10.2514/2.6486
Yu, W., Hull, J.H., and Choi, S.U.S., Stable and highly conductive nanofluids—experimental and theoretical studies, Proc. 6th ASME–JSME Thermal Engineering Joint Conf., Hawaiian Islands, New York, March 16–23, 2003, no. TED-AJ03-384, ASME.
Henderson, J.R. and van Swol, F., Mol. Phys., 1984, vol. 51, no. 4, pp. 991–1010. https://doi.org/10.1080/00268978400100651
Keblinski, P., Phillpot, S.R., Choi, S.U.S., and Eastman, J.A., Int. J. Heat Mass Transfer, 2002, vol. 45, no. 4, pp. 855–863. https://doi.org/10.1016/S0017-9310(01)00175-2
Nan, C.W., Liu, G., Lin, Y., and Li, M., Appl. Phys. Lett., 2004, vol. 85, no. 16, pp. 3549–3551. https://doi.org/10.1063/1.1808874
Xue, L., Phillpot, S.R., Choi, S.U.S., and Eastman, J.A., Int. J. Heat Mass Transfer, 2004, vol. 47, nos. 19–20, pp. 4277–4284. https://doi.org/10.1016/j.ijheatmasstransfer.2004.05.016
Wang, B., Zhou, L., and Peng, X., Int. J. Heat Mass Transfer, 2003, vol. 46, no. 14, pp. 2665–2672. https://doi.org/10.1016/S0017-9310(03)00016-4
Gao, J.W., Zheng, R.T., Ohtani, H., Zhu, D.S., and Chen, G., Nano Lett., 2009, vol. 9, no. 12, pp. 4128–4132. https://doi.org/10.1021/nl902358m
Gharagozlooo, P.E., Eaton, J.K., and Goodson, K.E., Аppl. Phys. Lett., 2008, vol. 93, no. 10, ID 103110. https://doi.org/10.1063/1.2977868
Gharagozlooo, P.E. and Goodson, K.E., J. Appl. Phys., 2010, vol. 108, no. 7, pp. 074309. https://doi.org/10.1063/1.3481423
Boshenyatov, B.V., Tech. Phys. Lett., 2018, vol. 44, no. 2, pp. 94–97. https://doi.org/10.1134/S1063785018020049
Murshed, S.M.S., Leong, K.C., and Yang, C., Appl. Therm. Eng., 2008, vol. 28, nos. 17–18, pp. 2109–2125. https://doi.org/10.1016/j.applthermaleng.2008.01.005
Wang, R.H. and Knudsen, J.G., Ind. Eng. Chem., 1958, vol. 50, no. 11, pp. 1667–1670. https://doi.org/10.1021/ie50587a042
Tareev, B.M., Colloid J., 1940, vol. 6, no. 6, pp. 545–550.
Ilyin, S.O., Arinina, M.P., Malkin, A.Y., and Kulichikhin, V.G., Colloid J., 2016, vol. 78, no. 5, pp. 608–615. https://doi.org/10.1134/S1061933X16050070
Malkin, A.Y., Ilyin, S.O., Arinina, M.P., and Kulichikhin, V.G., Colloid Polym. Sci., 2017, vol. 295, no. 4, pp. 555–563. https://doi.org/10.1007/s00396-017-4046-4
Gorbacheva, S.N., Yarmush, Y.M., and Ilyin, S.O., Tribol. Int., 2020, vol. 148, ID 106318. https://doi.org/10.1016/j.triboint.2020.106318
Ignatenko, V.Y., Kostyuk, A.V., Smirnova, N.M., Antonov, S.V., and Ilyin, S.O., Polym. Eng. Sci., 2020, vol. 60, pp. 2224–2234. https://doi.org/10.1002/pen.25465
Ilyin, S.O., Makarova, V.V., Polyakova, M.Y., and Kulichikhin, V.G., Rheol. Acta, 2020, vol. 59, pp. 375–386. https://doi.org/10.1007/s00397-020-01208-6
Ilyin, S.O., Makarova, V.V., Polyakova, M.Y., and Kulichikhin, V.G., Mater. Today Commun., 2020, vol. 22, ID 100833. https://doi.org/10.1016/j.mtcomm.2019.100833
Uriev, N.B., Russ. Chem. Rev., 2004, vol. 73, no. 1, pp. 39–62. https://doi.org/10.1070/RC2004v073n01ABEH000861
Ilyin, S.O., Malkin, A.Y., Kulichikhin, V.G., Shaulov, A.Y., Stegno, E.V., Berlin, A.A., and Patlazhan, S.A., Rheol. Acta, 2014, vol. 53, nos. 5–6, pp. 467–475. https://doi.org/10.1007/s00397-014-0770-6
Powell, R.W., Ho, C.Y., and Liley, P.E., Thermal Conductivity of Selected Materials, Washington, DC: US Department of Commerce, National Bureau of Standards, 1966, vol. 8.
Pop, E., Varshney, V., and Roy, A.K., MRS Bull., 2012, vol. 37, no. 12, pp. 1273–1281. https://doi.org/10.1557/mrs.2012.203
Presley, M.A. and Christensen, P.R., J. Geophys. Res.: Planets, 1997, vol. 102, no. E3, pp. 6535–6549. https://doi.org/10.1029/96JE03302
Braun, J.L., Olson, D.H., Gaskins, J.T., and Hopkins, P.E., Rev. Sci. Instrum., 2019, vol. 90, no. 2, ID 024905. https://doi.org/10.1063/1.5056182
Zhao, D., Qian, X., Gu, X., Jajja, S.A., and Yang, R., J. Electron. Packag., 2016, vol. 138, no. 4, pp. 040802–040821. https://doi.org/10.1115/1.4034605
Roder, H.M., Perkins, R.A., Laesecke, A., and de Castro, C.A.N., J. Res. Natl. Inst. Stand. Technol., 2000, vol. 105, no. 2, pp. 221–253. https://doi.org/10.6028/jres.105.028
Reiter, M. and Hartman, H., J. Geophys. Res., 1971, vol. 76, no. 29, pp. 7047–7051. https://doi.org/10.1029/JB076i029p07047
Mirkovich, V.V., J. Am. Ceram. Soc., 1965, vol. 48, no. 8, pp. 387–391. https://doi.org/10.1111/j.1151-2916.1965.tb14773.x
Yang, D.J., Zhang, Q., Chen, G., Yoon, S.F., Ahn, J., Wang, S.G., Zhou, Q., Wang, Q., and Li, J.Q., Phys. Rev. B, 2002, vol. 66, no. 16, pp. 165440–165446. https://doi.org/10.1103/PhysRevB.66.165440
Kumanek, B. and Janas, D., J. Mater. Sci., 2019, vol. 54, no. 10, pp. 7397–7427. https://doi.org/10.1007/s10853-019-03368-0
Kleinstreuer, C. and Feng, Y., Nanoscale Res. Lett., 2011, vol. 6, no. 1, pp. 229–242. https://doi.org/10.1186/1556-276X-6-229
Zawilski, B.M., Littleton, R.T., IV, and Tritt, T.M., Rev. Sci. Instrum., 2001, vol. 72, no. 3, pp. 1770–1774. https://doi.org/10.1063/1.1347980
Paul, G., Chopkar, M., Manna, I., and Das, P.K., Renew. Sustain. Energy Rev., 2010, vol. 14, no. 7, pp. 1913–1924. https://doi.org/10.1016/j.rser.2010.03.017
Nagasaka, Y. and Nagashima, A., J. Phys. E: Sci. Instrum., 1981, vol. 14, pp. 1435–1440. https://doi.org/10.1088/0022-3735/14/12/020
Assael, M.J., Antoniadis, K.D., and Wakeham, W.A., Int. J. Thermophys., 2010, vol. 31, no. 6, pp. 1051–1072. https://doi.org/10.1007/s10765-010-0814-9
Assael, M.J., Dix, M., Gialou, K., Vozar, L., and Wakeham, W.A., Int. J. Thermophys., 2002, vol. 23, no. 3, pp. 615–633. https://doi.org/10.1023/A:1015494802462
Assael, M.J., Antoniadis, K.D., Metaxa, I.N., Mylona, S.K., Assael, J.A.M., Wu, J., and Hu, M., Int. J. Thermophys., 2015, vol. 36, nos. 10–11, pp. 3083–3105. https://doi.org/10.1007/s10765-015-1964-6
Healy, J.J., De Groot, J.J., and Kestin, J., Physica B+C (Amsterdam), 1976, vol. 82, no. 2, pp. 392–408. https://doi.org/10.1016/0378-4363(76)90203-5
Log, T. and Gustafsson, S.E., Fire Mater., 1995, vol. 19, no. 1, pp. 43–49. https://doi.org/10.1002/fam.810190107
Czarnetzki, W. and Roetzel, W., Int. J. Thermophys., 1995, vol. 16, no. 2, pp. 413–422. https://doi.org/10.1007/BF01441907
Das, S.K., Putra, N., Thiesen, P., and Roetzel, W., J. Heat Transfer, 2003, vol. 125, no. 4, pp. 567–574. https://doi.org/10.1115/1.1571080
Yang, B. and Han, Z.H., Appl. Phys. Lett., 2006, vol. 89, no. 8, ID 083111. https://doi.org/10.1063/1.2338424
Cahill, D.G., Rev. Sci. Instrum., 1990, vol. 61, no. 2, pp. 802–808. https://doi.org/10.1063/1.1141498
Lu, L., Yi, W., and Zhang, D.L., Rev. Sci. Instrum., 2001, vol. 72, no. 7, pp. 2996–3003. https://doi.org/10.1063/1.1378340
Cahill, D.G. and Pohl, R.O., Phys. Rev. B, 1987, vol. 35, no. 8, ID 4067. https://doi.org/10.1103/PhysRevB.35.4067
Marovelli, R.L. and Veith, K.F., Thermal Conductivity of Rock: Measurement by the Transient Line Source Method, US Department of the Interior, Bureau of Mines, 1965, vol. 6604.
Lobo, H. and Cohen, C., Polym. Eng. Sci., 1990, vol. 30, no. 2, pp. 65–70. https://doi.org/10.1002/pen.760300202
Putnam, S.A., Cahill, D.G., Braun, P.V., Ge, Z., and Shimmin, R.G., J. Appl. Phys. (Melville, NY), 2006, vol. 99, no. 8, ID 084308. https://doi.org/10.1063/1.2189933
Krishnamurthy, S., Bhattacharya, P., Phelan, P.E., and Prasher, R.S., Nano Lett., 2006, vol. 6, no. 3, pp. 419–423. https://doi.org/10.1021/nl0522532
Swihart, M.T., Curr. Opin. Colloid Interface Sci., 2003, vol. 8, no. 1, pp. 127–133. https://doi.org/10.1016/S1359-0294(03)00007-4
Akoh, H., Tsukasaki, Y., Yatsuya, S., and Tasaki, A., J. Cryst. Growth, 1978, vol. 45, pp. 495–500. https://doi.org/10.1016/0022-0248(78)90482-7
Assael, M.J., Metaxa, I.N., Arvanitidis, J., Christophilos, D., and Lioutas, C., Int. J. Thermophys., 2005, vol. 26, pp. 647–664. https://doi.org/10.1007/s10765-005-5569-3
Liu, M.S., Lin, C.C.M., Huang, I.T., and Wang, C.C., Int. Commun. Heat Mass Transfer, 2005, vol. 32, no. 9, pp. 1202–1210. https://doi.org/10.1016/j.icheatmasstransfer.2005.05.005
Hwang, Y.J., Ahn, Y.C., Shin, H.S., Lee, C.G., Kim, G.T., Park, H.S., and Lee, J.K., Curr. Appl. Phys., 2006, no. 6, pp. 1068–1071. https://doi.org/10.1016/j.cap.2005.07.021
Hong, T., Yang, H., and Choi, C.J., J. Appl. Phys. (Melville, NY), 2005, vol. 97, no. 6, ID 064311. https://doi.org/10.1063/1.1861145
Hong, K.S., Hong, T., and Yang, H., Appl. Phys. Lett., 2006, vol. 88, no. 3, ID 031901. https://doi.org/10.1063/1.2166199
Choi, S.U.S., FED (Am. Soc. Mech.), 1995, vol. 231, pp. 99–105.
Murshed, S.M.S., Leong, K.C., and Wang, C., Int. J. Therm. Sci., 2005, vol. 44, no. 4, pp. 367–373. https://doi.org/10.1016/j.ijthermalsci.2004.12.005
Morozova, M.A. and Novopashin, S.A., Interfacial Phenom. Heat Transfer, 2019, vol. 7, no. 2, pp. 151–165. https://doi.org/10.1615/InterfacPhenomHeatTransfer.2019031015
Bardakhanov, S.P., Novopashin, S.A., and Serebryakova, M.A., Nanosist.: Fiz., Khim., Mat., 2012, vol. 3, no. 1, pp. 27–33.
Yu, W. and Choi, S.U.S., J. Nanopart. Res., 2003, vol. 5, nos. 1–2, pp. 167–171. https://doi.org/10.1023/A:1024438603801
Eastman, J.A., Phillpot, S.R., Choi, S.U.S., and Keblinski, P., Annu. Rev. Mater. Res., 2004, vol. 34, pp. 219–246. https://doi.org/10.1146/annurev.matsci.34.052803.090621
Patel, H.E., Das, S.K., Sundararajan, T., Nair, A.S., George, B., and Pradeep, T., Appl. Phys. Lett., 2003, vol. 83, no. 14, pp. 2931–2933. https://doi.org/10.1063/1.1602578
Liu, M., Lin, M., Tsai, C.Y., and Wang, C., Int. J. Heat Mass Transfer, 2006, vol. 49, pp. 3028–3033. https://doi.org/10.1016/j.ijheatmasstransfer.2006.02.012
Chon, C.H., Kihm, K.D., Lee, S.P., and Choi, S.U.S., Appl. Phys. Lett., 2005, vol. 87, no. 15, ID 153107. https://doi.org/10.1063/1.2093936
Chon, C.H. and Kihm, K.D., ASME J. Heat Transfer, 2005, vol. 127, no. 8, pp. 810. https://doi.org/10.1115/1.2033316
Xie, H., Wang, J., Xi, T., and Ai, F., J. Appl. Phys. (Melville, NY), 2002, vol. 91, pp. 4568–4572. https://doi.org/10.1063/1.1454184
Celzard, A., McRae, E., Deleuze, C., Dufort, M., Furdin, G., and Marêché, J.F., Phys. Rev. B, 1996, vol. 53, no. 10, pp. 6209–6214. https://doi.org/10.1103/PhysRevB.53.6209
Ilyin, S.O., Malkin, A.Y., and Kulichikhin, V.G., Colloid J., 2012, vol. 74, no. 4, pp. 472–482. https://doi.org/10.1134/S1061933X12040072
Brantseva, T.V., Ilyin, S.O., Gorbunova, I.Y., Antonov, S.V., Korolev, Y.M., and Kerber, M.L., Int. J. Adhes. Adhes., 2016, vol. 68, pp. 248–255. https://doi.org/10.1016/j.ijadhadh.2016.04.005
Malkin, A., Ilyin, S., and Kulichikhin, V., Appl. Rheol., 2014, vol. 24, no. 1, pp. 9–18. https://doi.org/10.3933/applrheol-24-13653
Xie, H., Lee, H., Youn, W., and Choi, M., J. Appl. Phys. (Melville, NY), 2003, vol. 94, no. 8, pp. 4967. https://doi.org/10.1063/1.1613374
Xie, H., Wang, J., Xi, T., and Liu, Y., Int. J. Thermophys., 2002, vol. 23, no. 2, pp. 571–580. https://doi.org/10.1023/A:1015121805842
Xie, H.Q., Wang, J.C., Xi, T.G., Liu, Y., and Ai, F., J. Mater. Sci. Lett., 2002, vol. 21, pp. 1469–1471. https://doi.org/10.1023/A:1020060324472
Chung, T.-H., Ajian, M., Lee, L.L., and Starling, K.E., Ind. Eng. Chem. Res., 1988, vol. 27, no. 4, pp. 671–679. https://doi.org/10.1021/ie00076a024
Assael, M.J., Chen, C.F., Metaxa, I., and Wakeham, W.A., Int. J. Thermophys., 2004, vol. 25, no. 4, pp. 971–985. https://doi.org/10.1023/B:IJOT.0000038494.22494.04
Ilyin, S.O., Pupchenkov, G.S., Krasheninnikov, A.I., Kulichikhin, V.G., and Malkin, A.Y., Colloid J., 2013, vol. 75, no. 3, pp. 267–273. https://doi.org/10.1134/S1061933X13030071
Malkin, A., Ilyin, S., Semakov, A., and Kulichikhin, V., Soft Matter, 2012, vol. 8, no. 9, pp. 2607–2617. https://doi.org/10.1039/C2SM06950D
Murshed, S.S., De Castro, C.N., Lourenço, M.J.V., Lopes, M.L.M., and Santos, F.J.V., Renew. Sustain. Energy Rev., 2011, vol. 15, no. 5, pp. 2342–2354. https://doi.org/10.1016/j.rser.2011.02.016
Huminic, G. and Huminic, A., Renew. Sustain. Energy Rev., 2012, vol. 16, no. 8, pp. 5625–5638. https://doi.org/10.1016/j.rser.2012.05.023
Bashirnezhad, K., Ghavami, M., and Alrashed, A.A., J. Mol. Liq., 2017, vol. 244, pp. 309–321. https://doi.org/10.1016/j.molliq.2017.09.012
Wen, D. and Ding, Y., Int. J. Heat Mass Transfer, 2004, vol. 47, no. 24, pp. 5181–5188. https://doi.org/10.1016/j.ijheatmasstransfer.2004.07.012
Ding, Y., Alias, H., Wen, D., and Williams, A.R., Int. J. Heat Mass Transfer, 2006, vol. 49, no. 12, pp. 240–250. https://doi.org/10.1016/j.ijheatmasstransfer.2005.07.009
Pak, B.C. and Cho, Y.I., Exp. Heat Transfer, 1998, vol. 11, no. 2, pp. 151–170. https://doi.org/10.1080/08916159808946559
Xuan, Y. and Li, Q., J. Heat Transfer, 2003, vol. 125, no. 1, pp. 151–155. https://doi.org/10.1115/1.1532008
Bang, I.C. and Chang, S.H., Int. J. Heat Mass Transfer, 2005, vol. 48, no. 12, pp. 2407–2419. https://doi.org/10.1016/j.ijheatmasstransfer.2004.12.047
Wen, D. and Ding, Y., J. Nanopart. Res., 2005, vol. 7, nos. 2–3, pp. 265–274. https://doi.org/10.1007/s11051-005-3478-9
Tavman, I., Turgut, A., Chirtoc, M., Schuchmann, H.P., and Tavman, S., Arch. Mater. Sci. Eng., 2008, vol. 34, no. 2, pp. 99–104.
Murshed, S.M.S., Leong, K.C., and Yang, C., Int. J. Therm. Sci., 2008, vol. 47, no. 5, pp. 560–568. https://doi.org/10.1016/j.ijthermalsci.2007.05.004
Wen, D. and Ding, Y., IEEE Trans. Nanotechnol., 2006, vol. 5, no. 3, pp. 220–227. https://doi.org/10.1109/TNANO.2006.874045
Wang, Y., Fisher, T.S., Davidson, J.L., and Jiang, L., Thermal conductivity of nanoparticle suspensions, Proc. 8th AIAA/ASME Joint Thermophysics and Heat Transfer Conf., USA, 2002, AIAA 2002–3345. https://doi.org/10.2514/6.2002-3345
Zhu, H., Zhang, C., Liu, S., Tang, Y., and Yin, Y., Appl. Phys. Lett., 2006, vol. 89, no. 2, ID 023123. https://doi.org/10.1063/1.2221905
Eastman, J.A., Choi, S.U.S., Li, S., and Thompson, L.J., in Proc. Symp. on Nanophase and Nanocomposite Materials II, USA: Materials Research Society, 1997, vol. 457.
Li, C.H. and Peterson, G.P., J. Appl. Phys. (Melville, NY), 2006, vol. 99, no. 8, pp. 084314. https://doi.org/10.1063/1.2191571
Murshed, S.M.S., Leong, K.C., and Yang, C., Int. J. Nanosci., 2006, vol. 5, no. 1, pp. 23–33. https://doi.org/10.1142/S0219581X06004127
Kwak, K. and Kim, C., Korea-Aust. Rheol. J., 2005, vol. 17, no. 2, pp. 35–40.
Liu, M.S., Lin, M.C.C., Huang, I.T., and Wang, C.C., Chem. Eng. Technol., 2006, vol. 29, no. 1, pp. 72–77. https://doi.org/10.1002/ceat.200500184
Wang, B.X., Zhou, L.P., and Peng, X.F., Int. J. Heat Mass Transfer, 2003, vol. 46, no. 14, pp. 2665–2672. https://doi.org/10.1016/S0017-9310(03)00016-4
Kumar, D.H., Patel, H.E., Kumar, V.R.R., Sundararajan, T., Pradeep, T., and Das, S.K., Phys. Rev. Lett., 2004, vol. 93, no. 14, pp. 4301–4304. https://doi.org/10.1103/PhysRevLett.93.144301
Chopkar, M., Das, P.K., and Manna, I., Scr. Mater., 2006, vol. 55, no. 6, pp. 549–552. https://doi.org/10.1016/j.scriptamat.2006.05.030
Xuan, Y. and Li, Q., J. Heat Transfer, 2003, vol. 125, no. 1, pp. 151–155. https://doi.org/10.1115/1.1532008
Xuan, Y., Li, Q., Zhang, X., and Fujii, M., J. Appl. Phys. (Melville, NY), 2006, vol. 100, no. 4, pp. 043507. https://doi.org/10.1063/1.2245203
Kang, H.U., Kim, S.H., and Oh, J.M., Exp. Heat Transfer, 2006, vol. 19, no. 3, pp. 181–191. https://doi.org/10.1080/08916150600619281
Biercuk, M.J., Llaguno, M.C., Radosavljevic, M., Hyun, J.K., Johnson, A.T., and Fischer, J.E., Appl. Phys. Lett., 2002, vol. 80, no. 15, pp. 2767–2769. https://doi.org/10.1063/1.1469696
Hwang, Y.J., Ahn, Y.C., Shin, H.S., Lee, C.G., Kim, G.T., Park, H.S., and Lee, J.K., Curr. Appl. Phys., 2006, vol. 6, no. 6, pp. 1068–1071. https://doi.org/10.1016/j.cap.2005.07.021
Zharov, A.V., Savinskii, N.G., Pavlov, A.A., and Evdokimov, A.N., Fundam. Issled., 2014, vol. 6, no. 8, pp. 1345–1350.
Temel, Ü.N. and Erdiş, E., BSEU J. Sci., 2019, vol. 6, pp. 123–134. https://doi.org/10.35193/bseufbd.577918
Ilyin, S., Roumyantseva, T., Spiridonova, V., Semakov, A., Frenkin, E., Malkin, A., and Kulichikhin, V., Soft Matter, 2011, vol. 7, no. 19, pp. 9090–9103. https://doi.org/10.1039/C1SM06007D
Ilyin, S.O. and Konstantinov, I.I., Liq. Cryst., 2016, vol. 43, no. 3, pp. 369–380. https://doi.org/10.1080/02678292.2015.1116627
Wang, X.Q. and Mujumdar, A.S., Int. J. Therm. Sci., 2007, vol. 46, no. 1, pp. 1–19. https://doi.org/10.1016/j.ijthermalsci.2006.06.010
Funding
The review was financially supported by the Russian Science Foundation (project no. 19-13-00178).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
The authors declare that they have no conflict of interest.
Additional information
Translated from Zhurnal Prikladnoi Khimii, No. 12, pp. 1696-1715, December, 2020 https://doi.org/10.31857/S0044461820120026
Rights and permissions
About this article
Cite this article
Makarova, V.V., Gorbacheva, S.N., Antonov, S.V. et al. On the Possibility of a Radical Increase in Thermal Conductivity by Dispersed Particles. Russ J Appl Chem 93, 1796–1814 (2020). https://doi.org/10.1134/S1070427220120022
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1070427220120022