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Formation of Ohmic Contacts to a Diamond-Like Carbon Layer Deposited on a Dielectric Diamond Substrate

  • XXIV INTERNATIONAL SYMPOSIUM “NANOPHYSICS AND NANOELECTRONICS”, NIZHNY NOVGOROD, MARCH 10–13, 2020
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Abstract

The fabrication process of ohmic contacts to a diamond-like carbon (DLC) layer is described with the sequential deposition of a Au/Mo/Ti metallic layer onto it. The contacts have good mechanical and adhesion properties. Their specific contact resistance is varied from 1.4 × 10–4 to 6.4 × 10–5 Ω cm2 depending on the DLC layer thickness. The temperature dependence of the layer film resistance is investigated. It is shown that thin DLC layers provide better characteristics of an ohmic contact due to their more uniform graphitization during thermal annealing.

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Funding

In this work, we used equipment of the Joint Use Common Research Center “Physics and Technology of Micro- and Nanostructures”. Deposition and investigation of the DLC layers is supported by the Presidential Grant of the Russian Federation for Young Candidates of Science no. MK-3450.2019.2.

In the part of the development of the SIMS procedure, this study was supported by the Russian Foundation for Basic Research, project no. 18-02-00565.

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Authors and Affiliations

  1. Institute for Physics of Microstructures, Russian Academy of Sciences, 603950, Afonino, Kstovskii rayon, Nizhny Novgorod oblast, Russia

    A. I. Okhapkin, P. A. Yunin, E. A. Arkhipova, S. A. Kraev, S. A. Korolyov, M. N. Drozdov & V. I. Shashkin

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  1. A. I. Okhapkin
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  2. P. A. Yunin
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  3. E. A. Arkhipova
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  4. S. A. Kraev
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  5. S. A. Korolyov
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  6. M. N. Drozdov
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  7. V. I. Shashkin
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Corresponding author

Correspondence to A. I. Okhapkin.

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The authors declare that they have no conflict of interest.

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Translated by N. Korovin

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Okhapkin, A.I., Yunin, P.A., Arkhipova, E.A. et al. Formation of Ohmic Contacts to a Diamond-Like Carbon Layer Deposited on a Dielectric Diamond Substrate. Semiconductors 54, 1056–1058 (2020). https://doi.org/10.1134/S1063782620090213

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  • DOI: https://doi.org/10.1134/S1063782620090213

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