Abstract
The structural state of the Cu-7.1% P and Cu-7.1% P-2% Ag solder melts are studied by viscometry and densitometry over a wide temperature range. The evolution of the microstructure of Cu-7.1% P solder ingots after heating of the melt at high temperatures is detected. The experimental results are interpreted using the concept of a microheterogeneous structure of a metallic liquid. 1 The alloy composition is given in wt %. 2 Trademark of a copper-phosphorus (Cu-7.1% P) solder.
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References
Phase Diagrams of Binary Metallic Systems: A Handbook, Ed. by N. P. Lyakishev (Mashinostroenie, Moscow, 1996), Vol. 2.
Handbook of Soldering, 3rd ed., Ed. by I. E. Petrunina (Mashinostroenie, Moscow, 2003).
I. G. Brodova, P. S. Popel’, N. M. Barbin, and N. A. Vatolin, Initial Melts as the Basis for the Formation of the Structure and Properties of Aluminum Alloys (UrO RAN, Yekaterinburg, 2005).
K. V. Nikitin, I. Yu. Timoshkin, V. I. Nikitin, O. A. Chikova, et al., “Effect of specific treatment methods on the properties of the melt and the structure of an A34 solder,” Metallurgiya Mashinostroeniya, No. 4, 17–21 (2011).
G. V. Tyaguniv, V. S. Tsepelev, M. N. Kushnir, and G. N. Yakovlev, “Equipment for measuring the kinematic viscosity of metallic melts,” Zavod. Lab., No. 10, 919–920 (1980).
A. Yu. Koshevnik, M. M. Kusakov, and N. M. Lubman, “Change in the surface tension from the sessile drop sizes,” Zh. Fiz. Khim. 27(12), 1886–1890 (1953).
M. V. Mal’tsev, Structural Modification of Metals and Alloys (Metallurgiya, Moscow, 1964).
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Original Russian Text © V.S. Tsepelev, N.A. Zaitseva, O.A. Chikova, 2015, published in Metally, 2015, No. 1, pp. 30–34.
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Tsepelev, V.S., Zaitseva, N.A. & Chikova, O.A. Effect of heat treatment of the Cu-7.1% P melt on the microstructure of the cast metal. Russ. Metall. 2015, 26–29 (2015). https://doi.org/10.1134/S0036029515010139
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DOI: https://doi.org/10.1134/S0036029515010139