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Parasitic Capacitance Analysis of PCB-type Induction Heating Coil and LCCC/S Matching Network Design for Railway Turnouts

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Abstract

Conventional de-icing systems use resistive heating wires to prevent the freezing of railway turnouts. Because of the low efficiency of the heating wires, induction heating (IH) systems have been investigated recently. The IH systems utilize high-frequency resonant inverters and heating coils to induce eddy currents and heat energy on heating plates. The heating coils can be manufactured with a printed-circuit-board (PCB) process. However, a short distance between PCB patterns can generate a significant parasitic capacitance, which resonates with the coil inductance. A self-resonance of the coil makes capacitive impedance at high-frequency ranges and distorts coil currents. This paper investigates the parasitic capacitance of PCB-type induction heating coils. Analytic models of the PCB-type heating coil are derived. In addition, a new LCCC/S impedance matching network (IMN) design that compensates for the parasitic capacitance is presented. The developed induction heating coil and IMN are demonstrated using experimental results.

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References

  1. Dindar S, Kaewunruen S, An M, Gigante-Barrera A (2017) Derailment-based fault tree analysis on risk management of railway turnout systems. IOP Conf Ser Mater Sci Eng. https://doi.org/10.1088/1757-899X/245/4/042020.Joseph

    Article  Google Scholar 

  2. Oh HS, Kim DK, Hong SM, Ryu SG, Park CB, Lee JB, Lee J, Lee HW (2022) Anti-icing system on railway turnouts using insduction heating technology for energy saving. In: 2022 IEEE 21st mediterranean electrotechnical conference (MELECON), pp 342–347. https://doi.org/10.1109/MELECON53508.2022.9842

  3. Oh HS, Park CB, Lee SH, Lee JB, Kim TH, Lee HW (2019) A study on de-icing for railway turnouts using 250kHz–200W-class induction heating system. AIP Adv. https://doi.org/10.1063/1.5129857

    Article  Google Scholar 

  4. Jeong SH, Park HP, Jung JH (2018) Design methodology of 3 kW Induction heating system for both low resistance and high resistance containers in a single burner. In: International power electronics conference (IPEC-Niigata 2018-ECCE Asia) pp 289–295. https://doi.org/10.23919/IPEC.2018.8507579

  5. Han W, Chau KT, Liu W, Tian X, Wang H (2022) A dual-resonant topology-reconfigurable inverter for all-metal induction heating. IEEE J Emerg Sel Top Power Electron 10(4):3818–3829. https://doi.org/10.1109/JESTPE.2021.3071700

    Article  Google Scholar 

  6. Chafi A, Idir N, Videt A, Maher H (2021) Design method of PCB inductors for high-frequency GaN converters. IEEE Trans Power Electron 36(1):805–814. https://doi.org/10.1109/TPEL.2020.3000438

    Article  Google Scholar 

  7. Islam AB, Islam SK, Tulip FS (2013) Design and optimization of printed circuit board inductors for wireless power transfer system. Circuits Syst 4(2):237–244. https://doi.org/10.4236/cs.2013.42032

    Article  Google Scholar 

  8. Serrano J, Lope I, Acero J, Carretero C, Burdio JM, Alonso R (2017) Design and optimization of small inductors on extra-thin PCB for flexible cooking surfaces. IEEE Trans Ind Appl 53(1):371–379. https://doi.org/10.1109/TIA.2016.2602217

    Article  Google Scholar 

  9. Schäfer J, Bortis D, Kolar JW (2020) Novel highly efficient/compact automotive PCB winding inductors based on the compensating Air-Gap fringing field concept. IEEE Trans Power Electron 35(9):9617–9631. https://doi.org/10.1109/TPEL.2020.2969295

    Article  Google Scholar 

  10. Lope I, Acero J, Burdio JM, Carretero C, Alonso R (2015) Design and implementation of PCB inductors with litz-wire structure for conventional-size large-signal domestic induction heating applications. IEEE Trans Ind Appl 51(3):2434–2442. https://doi.org/10.1109/TIA.2014.2382758

    Article  Google Scholar 

  11. Plumed E, Lope I, Acero J, Burdio JM (2022) Domestic induction heating system with standard primary inductor for reduced-size and high distance cookware. IEEE Trans Ind Appl 58(6):7562–7571. https://doi.org/10.1109/TIA.2022.3193107

    Article  Google Scholar 

  12. Hardock A, Dahl D, Brüns HD, Schuster C (2015) Efficient calculation of external fringing capacitances for physics-based PCB modeling. 2015 IEEE 19th workshop on signal and power integrity (SPI) pp 1–4. https://doi.org/10.1109/SaPIW.2015. 7237396

  13. Meng W, Zhang F, Dong G, Wu J, Li L (2021) Research on losses of PCB parasitic capacitance for GaN-based full bridge converters. IEEE Trans Power Electron 36(4):4287–4299. https://doi.org/10.1109/TPEL.2020.3024881

    Article  Google Scholar 

  14. Pajovic M, Yu J, Milojkovic D (2007) Analysis of via capacitance in arbitrary multilayer PCBs. IEEE Trans Electromagn Compat 49(3):722–726. https://doi.org/10.1109/TEMC.2007.902382

    Article  Google Scholar 

  15. Zulauf G, Liang W, Rivas-Davila J (2017) A unified model for high-power, air-core toroidal PCB inductors. In: 2017 IEEE 18th Workshop on control and modeling for power electronics (COMPEL) pp 1–8. https://doi.org/10.1109/COMPEL.2017.80 13401

  16. Sun B, Burgos R, Boroyevich D (2019) Ultralow input-output capacitance PCB-embedded dual-output gate-drive power supply for 650 V GaN-based half-bridges. IEEE Trans Power Electron 34(2):1382–1393. https://doi.org/10.1109/TPEL.2018.2828384

    Article  Google Scholar 

  17. Wurth Elektronik, Niedernhall, Germany. Standard FR4 TG135 Datasheet. Accessed: Aug 15 2022. [Online]. Available:http://www.wedirekt.com/web/mandators/media/16_wedirekt/spezifikationen/leiterplatten_daten_downloads/FR4TG135_UK.pdf

  18. Samwha Electronics, Yongin-si, South Korea. PL-F1. Accessed: Jan. 1, 2022. [Online]. Available: http://www.samwha.co.kr/electronics/

  19. Steel Grades, SUS430. Accessed: Jan. 1, 2022.[Online]. Available:https://www.steel-grades.com/Steel-Grades/Special-Steel/SUS430.html

  20. Arabi TB, Sarkar TK (1988) Analysis of multiconductor transmission lines. In: 31st ARFTG conference digest - Springer. pp 45–54. https://doi.org/10.1109/ARFTG.1988.323901.

  21. Association connecting electronics industries, IPC-2221A, (1998). Accessed: Aug 15, 2022. [Online]. Available:http://www.eng.lbl.gov/~shuman/NEXT/CURRENT_DESIGN/TP/MATERIALS/IPC-2221A(L).pdf

  22. Keysight Technologies, CA, USA. E5061B ENA Vector Network Analyzer. Accessed: Jan 1, 2022, [Online]. Available: https://www.keysight.com/en/pdx-x201771-pn-E5061B/ena-vector-network-analyzer?cc=MY&lc=eng

  23. Vishay general semiconductor, PA, USA. BU1006-M3/45. Accessed: Aug 15, 2022. [Online]. Available: https://www.vishay.com/en/product/84801//

  24. STMicroelectronics, Geneva, Switzerland. STP11N60DM2. Accessed: Aug. 15, 2022. [Online]. Available:https://www.st.com/en/powertransistors/stp11n60dm2.html

  25. Infineon Technologies, Neubiberg, Germany. IDH06G65C6. Accessed: Aug. 15, 2022. [Online]. Available:https://www.infineon.com/cms/en/product/power/diodes-thyristors/coolsic-schottky-diodes/idh06g65c6/

  26. Infineon Technologies, Neubiberg, Germany. IPW60R280P6 Accessed: Aug. 15, 2022. [Online]. Available: https://www.infineon.com/cms/en/product/power/mosfet/n-channel/500v-950v/ipw60r280p6/

  27. TEWA Sensors, Lublin, Poland. TT6–100KC3L-5-AUR Accessed: Aug. 15, 2022. [Online]. Available: https://tewa-sensors.com/products/thermistors/tt-6-series-thin-film-thermistors/

  28. Testo, Titisee-Neustadt, Germany. testo 875–1i-Thermal imager. Accessed: May 4, 2022. [Online]. Available: https://www.testo.com/en-TH/testo-875-1i/p/0563-0875-V1#

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Acknowledgements

This work is supported by Korea Agency for Infrastructure Technology Advancement grant funded by Ministry of Land, Infrastructure and transport. (RS-2018-KA146020).

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Correspondence to Hyung-Woo Lee.

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Oh, HS., Lee, J., Lee, SH. et al. Parasitic Capacitance Analysis of PCB-type Induction Heating Coil and LCCC/S Matching Network Design for Railway Turnouts. J. Electr. Eng. Technol. 18, 3311–3320 (2023). https://doi.org/10.1007/s42835-022-01372-0

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