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Effect of local preheating during ultrasonic welding of Al-Cu joints on strand compaction and bond formation

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Abstract

Ultrasonic metal welding represents a well-suited technology for various applications, especially regarding joining of dissimilar materials or sensitive components. For electrical applications, joining stranded wire to contact elements represents a particular challenge, as both the compaction of the strand and the bond towards the terminal have to be realised by the ultrasonic process. This investigation focusses on the influence of local preheating on the joint quality of EN AW 1070 stranded wire to NiP plated EN CW004A terminals, especially regarding strand compaction and bond formation at the interface. The objective of locally preheating the work piece on the sonotrode averted side is to adjust the heat input gradient over the strand cross section and therefore facilitate the deformation of the wires close to the interface. Thus, the compaction process of the strand can be accelerated, vibration damping losses throughout the strand can be reduced and more welding power/energy is available for the bond formation at the interface. The results show a significant increase in failure load, accompanied by a reduced scattering of the values. Moreover, the compaction of the strand and the contact area towards the terminal could also be enhanced by the applied strategy.

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References

  1. Lietz F J, Martens S, (2013) DE 102008058047 B4

  2. http://www.automobil-industrie.vogel.de/elektronik/articles/254417/, Vogel Business Media GmbH & Co. KG, 11.03.2010

  3. Ernst M, Heuermann M (2014) Die wichtigsten Bordnetz-Trends, Elektronik automotive Sonderausgabe Bordnetz

  4. Babiel, Gerhard (2011) Bordnetze, Fachhochschule Dortmund, http://ln.iuk.fh-dortmund.de/∼babiel/index/Dateien/Bordnetze%202011.pdf

  5. Oancă O, Sîrbu NA, Perianu IA (2014) Aspects concerning ultrasonic joining of multiwire connectors in automotive industry. Archives of Material Science and Engineering 66:67–73

    Google Scholar 

  6. Heinz S, Wagner G, Eifler D (2012) Ultrasonic welding of wires and cables. JOM 64:421–426

    Article  Google Scholar 

  7. Gutensohn M, Wagner G, Eifler D (2007) Ultraschallschweißen von Aluminiumlitzen. Schweißen und Schneiden 59:550–554

    Google Scholar 

  8. Universität Stuttgart (2004) Entwicklung eines Qualitätssicherungs(QS)-Systems für das Ultraschallschweißen auf Basis Neuronaler Netze unter Nutzung der von der Maschine zur Verfügung gestellten Messwerte, AiF-No. 12.937 N / DVS-No. 5.022

  9. Reske KP (2015) Langzeitverhalten von Schweißverbindungen mit Aluminiumleitungen für Hybrid- und Elektrofahrzeuge. Technische Universität München, Lehrstuhl für Hochspannungs- und Anlagentechnik

    Google Scholar 

  10. Braunovic M, Aleksandrov N (1994) Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current, IEEE transactions on components, packaging, and manufacturing technology: part A. Vol 17

  11. Ji H, Li M, Kung A T, Wang C, Li D (2005) The diffusion of Ni into Al wire at the interface of ultrasonic wire bond during high temperature storage, IEEE 6th International Conference on Electronic Packaging Technology

  12. Yang J, Cao B (2015) Investigation of resistance heat assisted ultrasonic welding of 6061 aluminum alloys to pure copper. Mater Des 74:19–24

    Article  Google Scholar 

  13. Xu H, Liu C, Silberschmidt VV, Wang H (2008) Effects of process parameters on bondability in thermosonic copper ball bonding. Electronic Components and Technology Conference 58:1424–1430

    Google Scholar 

  14. Shah A, Mayer M, Zhou Y, Hong SJ, Moon JT (2008) In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding. Microelectronics Engineering 85:1851–1857

    Article  Google Scholar 

Download references

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Authors and Affiliations

  1. Department of Production Technology, Technische Universität Ilmenau, Ilmenau, Germany

    Anna Regensburg, Franziska Petzoldt, René Schürer, Peter Hellwig & Jean Pierre Bergmann

Authors
  1. Anna Regensburg
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  2. Franziska Petzoldt
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  3. René Schürer
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  4. Peter Hellwig
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  5. Jean Pierre Bergmann
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Corresponding author

Correspondence to Anna Regensburg.

Additional information

Recommended for publication by Commission III - Resistance Welding, Solid State Welding, and Allied Joining Process

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Regensburg, A., Petzoldt, F., Schürer, R. et al. Effect of local preheating during ultrasonic welding of Al-Cu joints on strand compaction and bond formation. Weld World 61, 443–451 (2017). https://doi.org/10.1007/s40194-017-0434-0

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  • DOI: https://doi.org/10.1007/s40194-017-0434-0

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