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The Importance of Electroless Metallic Build-Up on Surface Modified Substrates for Multifunctional Engineering Applications: A Recent Progress Update

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Abstract

Electroless plating is a widely used methodology adopted by the industries as well as the academia as it permits the deposition of the metal onto various substrates like metals, ceramics or polymer devoid the usage of electricity. Extensive investigations have been conducted over the past decades on electroless plating owing to its continuous and uniform deposition of metal onto any substrate without electricity, which helps in augmenting the strength, structure and corrosion resistance of the substrate. Electroless plating helps in converting non-conductive substrate conductive by metalizing the substrate, wherein the metallic layer is deposited onto the substrate. Platings can be specifically tailored for realizing coveted properties by selecting the composition for versatile engineering applications extending from electronics to automobiles to avionics. This review article enumerates the various metallic electroless plating like nickel, copper, gold and silver with respect to copious substrates like metals, ceramics and polymers for above-mentioned engineering applications.

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Acknowledgement

The authors would like to thank Dr. Hina Gokhale, Vice Chancellor, Defence Institute of Advanced Technology (DU), Pune for the support. Authors also acknowledge Mr. Ramdayal, Prakash Gore, Ravi Magisetty and Ankit Malik for their continuous technical support during the preparation of the manuscript.

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  1. Structural Composite Fabrication Laboratory, Department of Metallurgical & Materials Engineering, Defence Institute of Advanced Technology (DU), Ministry of Defence, Girinagar, Pune, 411025, India

    Swaroop Gharde & Balasubramanian Kandasubramanian

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Gharde, S., Kandasubramanian, B. The Importance of Electroless Metallic Build-Up on Surface Modified Substrates for Multifunctional Engineering Applications: A Recent Progress Update. Trans Indian Inst Met 71, 2873–2892 (2018). https://doi.org/10.1007/s12666-018-1397-6

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