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A Superjunction Extended Triple Gate LDMOS with Charge Accumulation Effect

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Abstract

A novel LDMOS device featured with Super Junction (SJ) and Extended Triple Gate (ETG) is proposed, named ETG LDMOS is demonstrated by the numerical simulation. The ETG consists of a planner gate and two extended side gates. The side gates are formed the P-Pillar/Oxide/drift sandwich structure. Moreover, the side gates consist of two back-to-back P-Pillar/N-Pillar diodes which connected by the float ohmic contact. The anode of D1 is shortly connected with the Gate electrode, and the Cathode of D2 is shortly connected with the Drain electrode. At the OFF-state, the Source Potential and Gate Potential are equal (\( {V}_{\varvec{S}}={V}_{\varvec{G}}=\textbf{0}, {V}_{\varvec{GD}}<\textbf{0}\)), the D1 is blocked and sustain the negative \({V}_{\varvec{GD}}\) while the D2 is turn-on. The P-Pillar1 can be fully depleted and assisted to reduce the Internal electric field of the N-Pillar. Thus, the Breakdown Voltage (BV) of the device can be greatly enhanced. At the ON- state, the gate apply positive voltage, then \({V}_{\varvec{GD}}>\textbf{0}\), the D1 is turn-on and extended the gate voltage in the P-Pillar1 while the D2 is blocked. Then, the charge accumulation besides the side gates formed the extended channel. Consequently, the specific ON-resistance (\({R}_{\varvec{ON,sp}}\)) of the device can be decreased remarkably. As a result, the ETG achieves superior \({BV}-{R}_{\varvec{ON,sp}}\) trade-off relationship. Additionally, the Figured-On-Merit (FOM) is up to 29 MW/cm\(^\textbf{2}\).

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The data that support the findings of this study are openly available in the reference [17].

References

  1. Xu S, Gan KP, Samudra GS, Liang YC, Sin JKO (2000) 120 v interdigitated-drain ldmos (idldmos) on soi substrate breaking power ldmos limit. IEEE Trans Electron Devices 47(10):1980–1985. https://doi.org/10.1109/16.870584

    Article  ADS  CAS  Google Scholar 

  2. Disney D, Shen ZJ (2013) Review of silicon power semiconductor technologies for power supply on chip and power supply in package applications. IEEE Trans Power Electron 28(9):4168–4181. https://doi.org/10.1109/TPEL.2013.2242095

    Article  ADS  Google Scholar 

  3. Disney D, Letavic T, Trajkovic T, Terashima T, Nakagawa A (2017) High-voltage integrated circuits: History, state of the art, and future prospects. IEEE Trans Electron Devices 64(3):659–673. https://doi.org/10.1109/TED.2016.2631125

    Article  ADS  Google Scholar 

  4. Iqbal MM-H, Udrea F, Napoli E (2009) On the static performance of the resurf ldmosfets for power ics. In: 2009 21st international symposium on power semi-conductor devices & IC’s, pp. 247-250. https://doi.org/10.1109/ISPSD.2009.5158048

  5. Duan B, Yang Y (2011) Low specific on-resistance power mos transistor with multilayer carrier accumulation breaks the limit line of silicon. IEEE Trans Electron Devices 58(7):2057–2060. https://doi.org/10.1109/TED.2011.2132136

    Article  ADS  CAS  Google Scholar 

  6. Appels JA, Vaes HMJ (1979) High voltage thin layer devices (resurf devices). In: 1979 international electron devices meeting, pp. 238-241. https://doi.org/10.1109/IEDM.1979.189589

  7. Chung S-K (2000) An analytical model for breakdown voltage of surface implanted soi resurf ldmos. IEEE Trans Electron Devices 47(5):1006–1009. https://doi.org/10.1109/16.841233

    Article  ADS  CAS  Google Scholar 

  8. Qiao M, Yuan Z, Li Y, Zhou X, Jin F, Yang J, Cai Y, Li Z, Zhang B (2020) Suppression of hot-hole injection in high-voltage triple resurf ldmos with sandwich n-p-n layer: Toward high-performance and high-reliability. In: 2020 32nd international symposium on power semiconductor devices and ICs (ISPSD), pp. 415-418. https://doi.org/10.1109/ISPSD46842.2020.9170104

  9. Udrea F, Deboy G, Fujihira T (2017) Superjunction power devices, history, development, and future prospects. IEEE Trans Electron Devices 64(3):713–727. https://doi.org/10.1109/TED.2017.2658344

    Article  ADS  CAS  Google Scholar 

  10. Chen X-B, Sin JKO (2001) Optimization of the specific on-resistance of the coolmos/sup tm/. IEEE Trans Electron Devices 48(2):344–348. https://doi.org/10.1109/16.902737

    Article  ADS  Google Scholar 

  11. Wei J, Luo X, Zhang Y, Li P, Zhou K, Zhang B, Li Z (2016) High-voltage thin-soi ldmos with ultralow on-resistance and even temperature characteristic. IEEE Trans Electron Devices 63(4):1637–1643. https://doi.org/10.1109/TED.2016.2533022

    Article  ADS  CAS  Google Scholar 

  12. Deng G, Luo X, Zhao Z, Wei J, Cheng S, Li C, Ma Z, Zhang B, Zhang S (2020) Experimental study of 600 v accumulation-type lateral double-diffused mosfet with ultra-low on-resistance. IEEE Electron Device Lett 41(3):465–468. https://doi.org/10.1109/LED.2020.2970006

    Article  ADS  Google Scholar 

  13. Wei J, Luo X, Ma D, Wu J, Li Z, Zhang B (2016) Accumulation mode triple gate soi ldmos with ultralow on-resistance and enhanced transconductance. In: 2016 28th International symposium on power semiconductor devices and ICs (ISPSD), pp. 171-174. https://doi.org/10.1109/ISPSD.2016.7520805

  14. Chen W, Qin H, Zhang H, Han Z (2022) Bulk electron accumulation ldmos with extended superjunction gate. IEEE Trans Electron Devices 69(4):1900–1905. https://doi.org/10.1109/TED.2022.3147731

    Article  ADS  Google Scholar 

  15. Hisamoto D, Lee W-C, Kedzierski J, Takeuchi H, Asano K, Kuo C, Anderson E, King T-J, Bokor J, Hu C (2000) Finfet-a self-aligned double-gate mosfet scalable to 20 nm. IEEE Trans Electron Devices 47(12):2320–2325. https://doi.org/10.1109/16.887014

    Article  ADS  CAS  Google Scholar 

  16. Ding H, Yuan L, Yin B (2022) Introduction to finfet: Formation process, strengths, and future exploration. In: EMIE 2022; The 2nd international conference on electronic materials and information engineering, pp. 1–7

  17. Lyu X, Chen X (2013) An ultralow specific on-resistance ldmost using charge balance by split p-gate and n-drift regions. IEEE Trans Electron Devices 60(11):3821–3826. https://doi.org/10.1109/TED.2013.2283426

    Article  ADS  CAS  Google Scholar 

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Acknowledgements

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Funding

National Nature Science Foundation of China (Grants Nos.61604027). The Key scientific research project of Chongqing Municipal Education Commission under Grants KJZD-K202300610.

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Y.H wrote the main manuscript text, W.C and Z.D made revision to the article. Y.H contributed to contributed to the study conception and design. The first draft of the manuscript was written by Y.H, W.C and Z.D commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Yuting He.

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He, Y., Chen, W. & Duan, Z. A Superjunction Extended Triple Gate LDMOS with Charge Accumulation Effect. Silicon 16, 1703–1711 (2024). https://doi.org/10.1007/s12633-023-02788-7

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