Abstract
The promising capability of Triple Material Surrounding Gate Junctionless Tunnel FET (TMSG – JL – TFET) based 6 T SRAM structure is demonstrated by employing Germanium (Ge) and High-K gate dielectric material. The high – K insulation guarantees the proposed device to be used in low leakage memory systems. The corresponding analytical model is developed to extract various device parameters such as surface potential, electric field and threshold voltage. The results yield minimization of hot carrier effects at the drain end, when compared to conventional Silicon (Si) based Tunnel FETs (TFETs). Further, the ambipolar characteristics of the proposed device is explored and 6 T Ge – TMS – SG – JL – TFET based SRAM design is proposed. The results are compared with CMOS based SRAM and the analytical model presented is validated using 3D - TCAD ATLAS simulation, which ensures the accuracy and exactness of the developed model.
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We thank the anonymous referees for their useful suggestions.
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Author 1 (G. Lakshmi Priya): Conceived and design the analysis, contributed data and analysis tools, and wrote the paper. Author 2 (M. Venkatesh): Performed the analysis, calibrated the results, and wrote the paper. Author 3 (N. B. Balamurugan): Worked in TCAD portion of the proposed device, Experimental data analysis. Author 4 (T. S. Arun Samuel): Worked in TCAD simulation of SRAM design, and wrote the paper for the corresponding portion.
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Priya, G.L., Venkatesh, M., Balamurugan, N.B. et al. Triple Metal Surrounding Gate Junctionless Tunnel FET Based 6T SRAM Design for Low Leakage Memory System. Silicon 13, 1691–1702 (2021). https://doi.org/10.1007/s12633-021-01075-7
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DOI: https://doi.org/10.1007/s12633-021-01075-7