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A fractal model for predicting thermal contact conductance considering elasto-plastic deformation and base thermal resistances

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Abstract

A prediction model of thermal contact conductance is developed. Engineering rough surfaces are characterized by three-dimensional fractal Weierstrass-Mandelbrot fractal function. Three deformation modes, including fully plastic deformation, elasto-plastic deformation and elastic deformation, are considered to analyze the contact mechanism. Fractal surface and three deformation modes are incorporated into the calculation of thermal contact conductance. A comprehensive thermal contact conductance computation model considering both base thermal resistance and constricted thermal resistance is established. The results show that thermal contact conductance increases with the increase of normal contact pressure; the relative contribution of constricted resistance component to base resistance component tends to increase with the increase of normal contact pressure; fractal dimension and fractal roughness both have significant influences on thermal contact conductance.

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Authors and Affiliations

  1. Key Laboratory of Education Ministry for Modern Design & Rotor-Bearing System, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an, 710049, China

    Jinhua Zhang, Yili Liu, Ke Yan & Bin Fang

Authors
  1. Jinhua Zhang
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  2. Yili Liu
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  3. Ke Yan
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  4. Bin Fang
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Corresponding author

Correspondence to Ke Yan.

Additional information

Recommended by Associate Editor Bong Jae Lee

Ke Yan received his Ph.D. in the School of Mechanical Engineering from Shandong University, China, in 2012. Currently, he is an Associate Professor and master tutor in the School of Mechanical Engineering, Xi’an Jiaotong University, China.

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Zhang, J., Liu, Y., Yan, K. et al. A fractal model for predicting thermal contact conductance considering elasto-plastic deformation and base thermal resistances. J Mech Sci Technol 33, 475–484 (2019). https://doi.org/10.1007/s12206-018-1247-9

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  • DOI: https://doi.org/10.1007/s12206-018-1247-9

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