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Experimental study on high-power LEDs integrated with micro heat pipe

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Abstract

Micro heat pipe (MHP) is applied to implement the efficient heat transfer of light emitting diode (LED) device. The fabrication of MHP is based on micro-electro-mechanical-system (MEMS) technique, 15 micro grooves were etched on one side of silicon (Si) substrate, which was then packaged with aluminum heat sink to form an MHP. On the other side of Si substrate, three LED chips were fixed by die bonding. Then experiments were performed to study the thermal performance of this LED device. The results show that the LED device with higher filling ratio is better when the input power is 1.0 W; with the increase of input power, the optimum filling ratio changes from 30% to 48%, and the time reaching stable state is reduced; when the input power is equal to 2.5 W, only the LED device with filling ratio of 48% can work normally. So integrating MHP into high-power LED device can implement the effective control of junction temperature.

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Authors and Affiliations

  1. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China

    Cong-ming LI  (李聪明), Chuan-peng Zhou  (周传鹏), Mohammad Hamidnia & Bo You  (由博)

  2. Key Laboratory for Precision and Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian, 116024, China

    Yi Luo  (罗怡) & Xiao-dong Wang  (王晓东)

Authors
  1. Cong-ming LI  (李聪明)
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  2. Chuan-peng Zhou  (周传鹏)
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  3. Yi Luo  (罗怡)
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  4. Mohammad Hamidnia
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  5. Xiao-dong Wang  (王晓东)
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  6. Bo You  (由博)
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Corresponding author

Correspondence to Yi Luo  (罗怡).

Additional information

This work has been supported by the State Key Development Program for Basic Research of China (No.2011CB013105).

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LI, Cm., Zhou, Cp., Luo, Y. et al. Experimental study on high-power LEDs integrated with micro heat pipe. Optoelectron. Lett. 12, 31–34 (2016). https://doi.org/10.1007/s11801-016-5231-2

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  • DOI: https://doi.org/10.1007/s11801-016-5231-2

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