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The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites

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Abstract

In this study, we examined the effect of process flow on the bonding properties of carbon fiber/copper composites. The carbon fiber surface was first subjected to hot air oxidation degumming treatment, and then plasma treatment was performed after filling a vacuum environment with Ar. The magnetron sputtering process was used, and the carbon fiber/copper composite was prepared by selecting titanium as the intermediate transition layer and copper as the plating metal. The experimental results indicated that the peeling strength of copper/carbon fiber interface was highest when the plasma was treated for 30 s. As a transition layer, titanium plays a vital role in the peeling strength of copper/carbon fiber, and forming a Ti-C bond improves the peeling strength. In the range of 20-150 V, the peeling strength of carbon fiber/copper increased with the increase of titanium and copper substrate bias voltage. This is because the diffusion and adhesion of titanium and copper atoms fill the pores and improve compactness.

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Funding

This work was supported by Fundamental Research Funds for the Central Universities (Grant No. FRF-BD-20-25A).

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Authors and Affiliations

  1. Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Ruijun Wang, Xiaolu Pang, Lining Xu & Lijie Qiao

  2. The 29th Research Institute of CETC, Chengdu, 610036, Sichuan, China

    Jingbo Liu & Tianshi Wang

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  1. Ruijun Wang
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  4. Xiaolu Pang
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Correspondence to Lining Xu.

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Wang, R., Liu, J., Wang, T. et al. The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites. J. of Materi Eng and Perform 32, 10924–10933 (2023). https://doi.org/10.1007/s11665-023-07894-6

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  • DOI: https://doi.org/10.1007/s11665-023-07894-6

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