Abstract
Tin-zinc solder alloys are considered to be appropriate for soldering of aluminum alloys at low-temperature in electronics and radiators applications. In this paper, the effects of different soldering parameters on the microstructure and interfacial reaction behaviors of 1070Al/Sn-9Zn/1070Al joints were investigated. The results show that the Al substrate was dissolved by the liquid solder, but Al-related intermetallic was not observed in the interface. Two kinds of Al-rich phases formed in the solder matrix. Large butterfly-shaped solid solution (Al)″ phases (about 10 μm) were formed in the liquid alloys, and compact-shaped precipitations (nano-size) were dissolved out from solders during solidification process. With increasing of the soldering time, Al″ phases were migrated upwards in the solders and the amount of this phase increased. In addition, with the increase of the soldering temperature, the dissolution rate of Al into the solder increased and the formation time of (Al)″ phases was reduced. Shear test results indicate when soldered at 250 °C, the shear strength increased from 48.6 MPa to a maximum 60.5 MPa and then decreased to a stable value (about 55 MPa) with increasing of the soldering time. Similar trends were also observed at 300 and 350 °C, while the soldering time needed to obtain maximum shear strength was shortened. The formation of these Al-rich phases improves the shear strength but deteriorates the ductility.
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The authors would like to acknowledge the financial support from the National Natural Science Foundation of China (51004039).
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Yao, Y., Feng, X., Jian, Z. et al. Effect of the Soldering Process on the Microstructure and Mechanical Properties of Sn-9Zn/Al Solder Joints. J. of Materi Eng and Perform 24, 2908–2916 (2015). https://doi.org/10.1007/s11665-015-1577-z
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DOI: https://doi.org/10.1007/s11665-015-1577-z