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Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

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Abstract

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M ≈ 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M ≈ 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications.

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Authors and Affiliations

  1. Institute of Physics of Materials, AS CR, Zizkova 22, 61662, Brno, Czech Republic

    Ales Kroupa

  2. Swerea IVF, Mölndal, Sweden

    Dag Andersson

  3. ITRI Ltd., Curo Park, St. Albans, UK

    Nick Hoo & Jeremy Pearce

  4. SPEME, University of Leeds, Leeds, UK

    Andrew Watson

  5. National Physical Laboratory, Teddington, UK

    Alan Dinsdale

  6. Ceravision Limited, The Mansion, Bletchley Park, MK3 6EB, UK

    Stuart Mucklejohn

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  1. Ales Kroupa
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  2. Dag Andersson
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  4. Jeremy Pearce
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  6. Alan Dinsdale
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  7. Stuart Mucklejohn
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Correspondence to Ales Kroupa.

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Kroupa, A., Andersson, D., Hoo, N. et al. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering. J. of Materi Eng and Perform 21, 629–637 (2012). https://doi.org/10.1007/s11665-012-0125-3

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