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Investigations on the Electrical Performances of CuNPs/BN/EPDM Composites

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Abstract

Rubber-based insulation materials have been widely used in the field of electrical engineering. To develop rubber with excellent nonlinear electrical conductivity can relieve the electric field concentration in the stress cone of a cable accessory. In this study, ethylene propylene diene monomer (EPDM) was selected as the rubber matrix, and copper nanoparticles (CuNPs) were grown on hexagonal boron nitride (BN) using a liquid-phase chemical reduction method. The prepared CuNPs/BN fillers were introduced into the EPDM matrix to obtain CuNPs/BN/EPDM composites. The microstructures of fillers and composites were systematically characterized. Specifically, the electrical conductivity and breakdown field strength at different temperatures were measured and analyzed. The results show that filling CuNPs/BN enables the EPDM to have outstanding nonlinear electrical conductivity and weakens the temperature dependence of the electric breakdown strength. The simulation analyses also prove that CuNPs/BN/EPDM composites with nonlinear conductivity can avoid the electric field concentration in the stress cone, which is beneficial to ensure the safety and reliability operation of a cable accessory.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (No. 51807042), Outstanding Youth Fund of Heilongjiang Province (No. YQ2020E031), China Postdoctoral Science Foundation (No. 2021T140166), Fundamental Research Foundation for Universities of Heilongjiang Province, (2019-KYYWF-0208), Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices (No. KFJJ201904).

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Authors and Affiliations

  1. Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, School of Electrical and Electronic Engineering, Harbin University of Science and Technology, Harbin, 150080, China

    Tiandong Zhang, Chuanxian Dai, Changhai Zhang & Qingguo Chi

  2. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology, Chengdu, 611731, China

    Changhai Zhang

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  1. Tiandong Zhang
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  2. Chuanxian Dai
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  4. Qingguo Chi
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Correspondence to Qingguo Chi.

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Zhang, T., Dai, C., Zhang, C. et al. Investigations on the Electrical Performances of CuNPs/BN/EPDM Composites. J. Electron. Mater. 51, 1349–1357 (2022). https://doi.org/10.1007/s11664-021-09397-3

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  • DOI: https://doi.org/10.1007/s11664-021-09397-3

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