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Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate

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Abstract

The effect of Ni nanoparticles on the microstructure evolution of a Sn-3.0Ag-0.5Cu (SAC305)-xNi (x = 0, 0.1)/Cu-2.0Be solder joint during reflow and aging was investigated. The results showed that the doped Ni nanoparticles changed the intermetallic compound (IMC) morphology from a scallop-like structure into a planar-like structure. The interfacial IMC layer thickness of the SAC305/Cu-2.0Be solder joint was greater than that of the SAC305-0.1Ni/Cu-2.0Be solder joint after reflow and aging. During reflow, the average IMC growth rate of the SAC305/Cu-2.0Be solder joint was 1.62 × 10−2 μm/s, while the average IMC growth rate of the SAC305-0.1Ni/Cu-2.0Be solder joint was 1.56 × 10−2 μm/s. During aging, the growth rates of the interfacial IMC layer of the SAC305/Cu-2.0Be solder joint and SAC305-0.1Ni/Cu-2.0Be solder joint were 1.86 × 10−5 μm/s and 1.46 × 10−5 μm/s, respectively. The results show that a trace amount of Ni nanoparticles can impede the growth rate of the interfacial IMC layer.

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Acknowledgments

This work was supported by the Key Laboratory Foundation of Metal Material Microstructure Control of Jiangxi Province (EJ201903064), Doctoral Research Fund of Nanchang Hangkong University (EA202003209), Jiangxi Provincial Natural Science Foundation (20202BABL214025), Aviation Science Funds of China (201911056001).

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Authors and Affiliations

  1. Key Laboratory for Microstructural Control of Metallic Materials of Jiangxi Province, Nanchang Hangkong University, Nanchang, 330063, China

    Zuozhu Yin

  2. School of Aerospace Manufacturing Engineering, Nanchang Hangkong University, 696 Fenghe South Road, Nanchang, 330063, China

    Zuozhu Yin, Mei Lin & Qi Li

  3. Harbin Welding Institute Limited Company, Harbin, 150028, China

    Xiaochun Lv

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  1. Zuozhu Yin
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  2. Mei Lin
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Correspondence to Zuozhu Yin.

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Yin, Z., Lin, M., Li, Q. et al. Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate. J. Electron. Mater. 49, 6721–6726 (2020). https://doi.org/10.1007/s11664-020-08453-8

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