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Microfabrication of Low Cost Frequency Selective Surface for Terahertz Wave by Laser Ablation

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Abstract

A method of fabricating and characterizing terahertz frequency selective surface filters from a low-cost silver adhesive tape has been reported in this paper. The proposed filter was initially evaluated numerically using the method of moment’s simulation and verified experimentally by terahertz time-domain spectroscopy technique. The numerical results show that the cross aperture frequency selective surface has angle-resolved and polarization independent operation. The proposed silver adhesive tape and conventional copper-based frequency selective surface have been fabricated using a laser micromachining process. A 20 ns-pulsed laser operating at 1064 nm wavelength was used to create the desired structure by ablation mechanism in the copper film. The pattern ablated by the laser is a cross-shaped slit on copper and silver adhesive tape. The patterned structure was designed to resonate at 0.25 THz by the cross-arm structure. The fabricated structure shows the peak transmittance of 90% with a full-width half maximum of 48% with respect to the resonance. The adhesive tape based frequency selective surface provides similar transmission characteristics compared to a conventional frequency selective surface.

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Authors and Affiliations

  1. Department of Electronics and Communication Engineering, SSN College of Engineering, Chennai, 603110, India

    Manikandan Esakkimuthu, Sreeja Balakrishnapillai Suseela & Radha Sankarrajan

  2. Department of Condensed Matter Physics and Material Science, Tata Institute of Fundamental Research, Mumbai, 400005, India

    Abhishek Gupta & Shriganesh Prabhu

Authors
  1. Manikandan Esakkimuthu
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  2. Sreeja Balakrishnapillai Suseela
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  3. Radha Sankarrajan
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  4. Abhishek Gupta
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  5. Shriganesh Prabhu
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Correspondence to Manikandan Esakkimuthu.

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Esakkimuthu, M., Suseela, S.B., Sankarrajan, R. et al. Microfabrication of Low Cost Frequency Selective Surface for Terahertz Wave by Laser Ablation. J. Electron. Mater. 48, 2423–2429 (2019). https://doi.org/10.1007/s11664-019-07008-w

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  • DOI: https://doi.org/10.1007/s11664-019-07008-w

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