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Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures

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Abstract

A characterization of mechanical and micromechanical properties of SAC305 solder wire under varied strain rates and temperatures was performed using tensile and nanoindentation tests. The evolution of SAC305 lead-free solder wire grains was compared in samples that were subjected to various strain rates and temperatures using tensile tests based on ASTM E12 standards. Different behaviours of mechanical properties, micromechanical properties, and microstructure evolution of SAC305 solder wire were observed when either temperature or strain rate was held constant and the other varied. Both tensile and nanoindentation tests produced qualitative results, such as dynamic recovery and occurrence of pop-in events, that reflected changes of microstructure. It was observed that some of the mechanical properties of SAC305 solder wire, namely yield strength (YS), ultimate tensile strength (UTS) and Young’s modulus, showed the same trends, but with lower values, compared to micromechanical properties obtained from nanoindentation tests based upon hardness and reduced modulus. Microstructure examination further confirms that the YS, UTS and hardness values increase with more solder wire grain refinement. SAC305 solder wire also maintained an equiaxed structure under various strain rates and temperatures.

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Acknowledgement

This work is supported by the Universiti Kebangsaan Malaysia (UKM) under Research University Grants (UKM-OUP-NBT-29-143/2011, OUP-2012-120 and DIP-2012-14).

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Authors and Affiliations

  1. Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600, UKM, Selangor, Malaysia

    Izhan Abdullah & Azman Jalar

  2. Universiti Kuala Lumpur (UniKL), British Malaysia Institute (BMI), Electrical Engineering Section, Jalan Sungai Pusu, 53100, Gombak, Selangor, Malaysia

    Muhammad Nubli Zulkifli

  3. Visual Arts Program, Cultural Centre, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Roslina Ismail

  4. RedRing Solder (Malaysia) Sdn. Bhd. (RSM), Lot 17486, Jalan Dua, Taman Selayang Baru, 68100, Batu Caves, Selangor, Malaysia

    Mohd Arrifin Ambak

Authors
  1. Izhan Abdullah
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  2. Muhammad Nubli Zulkifli
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  3. Azman Jalar
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  4. Roslina Ismail
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  5. Mohd Arrifin Ambak
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Correspondence to Azman Jalar.

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Abdullah, I., Zulkifli, M.N., Jalar, A. et al. Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures. J. Electron. Mater. 48, 2826–2839 (2019). https://doi.org/10.1007/s11664-019-06985-2

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  • DOI: https://doi.org/10.1007/s11664-019-06985-2

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