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Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders

  • TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder
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Abstract

Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result of electromigration (EM) damage. Current stressing occurs when current flows in a solder bump, thereby producing EM. Joule heating is also a significant occurrence under current stressing conditions, and induces thermomigration (TM) in solder bumps during EM. This study investigated the intermetallic compound (IMC) growth kinetics for Sn-0.7Cu solders, modeled by EM, TM, and chemical diffusion. The modeling results concurred with the observed kinetics of IMC growth. Electromigration influenced the growth of IMCs most significantly for a current density of 10 kA/cm2. The effect of TM on the IMC growth had to be considered for a thermogradient of 870°C/cm. However, the effect of chemical diffusion was insignificant on IMC growth, specifically for a current density of 10 kA/cm2.

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Acknowledgments

This work was supported by the National Research Foundation of Korea (NRF) Grant Funded by the Korea government (MSIT) through GCRC-SOP (Grant No. 2011-0030013).

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Authors and Affiliations

  1. Samsung Electro-Mechanics, Seobuk-gu, Cheonan-si, Chungcheongnam-do, 31086, Republic of Korea

    Sung-Min Baek

  2. Department of Materials Science and Engineering, Pusan National University, Busan, 46241, Republic of Korea

    Yujin Park & Namhyun Kang

  3. Korea Electronics Technology Institute, Seongnam, Gyeonggi-do, 13509, Republic of Korea

    Cheolmin Oh

  4. Busan Machinery Research Center, Korea Institute of Machinery and Materials, Busan, 46744, Republic of Korea

    Eun-Joon Chun

Authors
  1. Sung-Min Baek
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  2. Yujin Park
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  4. Eun-Joon Chun
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  5. Namhyun Kang
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Correspondence to Namhyun Kang.

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Baek, SM., Park, Y., Oh, C. et al. Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders. J. Electron. Mater. 48, 142–151 (2019). https://doi.org/10.1007/s11664-018-6786-4

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  • DOI: https://doi.org/10.1007/s11664-018-6786-4

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