Abstract
Diffusion of Cu inside Sn was studied through interfacial interactions between Cu and Sn nanoparticles without using any soldering additives. The studies conducted in this research revealed that the diffusion of Cu towards Sn nanoparticles was as high as 30 nm and 84 nm, respectively, when the Cu and Sn nanoparticles were heated at 150°C and 210°C under H2/N2. The atomic flux of Cu diffusion into the Sn nanoparticles during interfacial reactions at 150°C was higher than that of the Cu diffusion into bulk Sn. High Cu flux resulted in the formation of intermetallic compounds Cu6Sn5 at 150°C and Cu6Sn5 and Cu3Sn at 210°C without an observable diffusion layer.
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Acknowledgements
The support of this study by the Ministry of Science and Technology (MOST) of the Republic of China (Taiwan) under Grant NSC101-2221-E006-117-MY3 is gratefully acknowledged. One of the authors (J. Mittal) greatly appreciates his financial support under Grant NSC102-2811–E-006-048.
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Mittal, J., Lin, KL. Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles. J. Electron. Mater. 46, 602–608 (2017). https://doi.org/10.1007/s11664-016-4957-8
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DOI: https://doi.org/10.1007/s11664-016-4957-8