Skip to main content
SpringerLink
Log in

Thermoelectric Thin Film Devices for Energy Harvesting with the Heat Dissipated from High-Power Light-Emitting Diodes

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

We examined the power-generation characteristics of thin-film devices using the heat dissipated from high-power light-emitting diodes. The thin-film device was fabricated around an light-emitting diode (LED) chip by electrodepositing four pairs of the 10 μm-thick Bi2Te3 and Sb2Te3 films using either the high resistive Ti seed layer or the more conductive Ti/Cu/Au seed layer. The seed layer effect was more profound for the output power of the thin-film device than its output voltage. The open circuit voltages of 0.61 mV at ΔT for 4.1 K and 0.52 mV at ΔT for 4.9 K were obtained for the thin-film devices fabricated on the highly resistive Ti seed layer and the more conductive Ti/Cu/Au seed layer, respectively. Compared to 0.64 nW at ΔT for 4.1 K for the device processed on the more resistive Ti seed layer, a large maximum output power of 33.6 nW was obtained at ΔT of 4.9 K for the device built on the less resistive Ti/Cu/Au seed layer.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Y.B. Yoon and J.W. Park, IEEE Trans. Compon. Packag. Technol. 32, 825 (2009).

    Article  Google Scholar 

  2. M.Y. Kim, T. Jeong, J.S. Ha, and T.S. Oh, J. Electron. Mater. 43, 630 (2014).

    Article  Google Scholar 

  3. O.B. Shchekin, J.E. Epler, T.A. Trottier, T. Margalith, D.A. Steigerwald, M.O. Holcomb, P.S. Martin, and M.R. Krames, Appl. Phys. Lett. 89, 071109 (2006).

    Article  Google Scholar 

  4. T. Jeong, K.H. Kim, S.J. Lee, S.H. Lee, S.R. Jeon, S.H. Lim, J.H. Baek, and J.K. Lee, IEEE Photon. Technol. Lett. 21, 890 (2009).

    Article  Google Scholar 

  5. T. Jeong, K.H. Kim, H.H. Lee, S.J. Lee, S.H. Lee, J.H. Baek, and J.K. Lee, IEEE Photon. Technol. Lett. 20, 1932 (2008).

    Article  Google Scholar 

  6. R.J.M. Vullers, R. van Schaijk, I. Doms, C. Van Hoof, and R. Mertens, Solid-State Electron. 53, 684 (2009).

    Article  Google Scholar 

  7. T. Huesgen, P. Woias, and N. Kockmann, Sens. Actuators A 145–146, 423 (2008).

    Article  Google Scholar 

  8. W. Wang, V. Cionca, N. Wang, M. Hayes, B. O’Flynn, and C. O’Mathuna, Int. J. Distrib. Sens. Netw. 2013, 232438 (2013).

    Google Scholar 

  9. W. Glatz, S. Muntwyler, and C. Hierold, Sens. Actuators A 132, 337 (2006).

    Article  Google Scholar 

  10. J.P. Carmo, J.F. Ribeiro, M.F. Goncalves, and J.H. Correia, J. Micromech. Microeng. 20, 1 (2010).

    Article  Google Scholar 

  11. G.J. Snyder, J.R. Lim, C.-K. Huang, and J.-P. Fleurial, Nat. Mater. 2, 528 (2003).

    Article  Google Scholar 

  12. M.Y. Kim and T.S. Oh, J. Electron. Mater. 42, 2752 (2013).

    Article  Google Scholar 

  13. S.K. Lim, M.Y. Kim, and T.S. Oh, Thin Solid Films 517, 4199 (2009).

    Article  Google Scholar 

  14. B.Y. Yoo, C.K. Huang, J.R. Lim, J. Herman, M.A. Ryan, J.P. Fleurial, and N.V. Myung, Electrochim. Acta 50, 4371 (2005).

    Article  Google Scholar 

  15. Y. Miyazaki and T. Kajitani, J. Cryst. Growth 229, 542 (2001).

    Article  Google Scholar 

  16. M. Takahashi, M. Kojima, S. Sato, N. Ohnisi, A. Nishiwaki, K. Wakita, T. Miyuki, S. Ikeda, and Y. Muramatsu, J. Appl. Phys. 96, 5582 (2004).

    Article  Google Scholar 

  17. C. Schumacher, K.G. Reinsberg, L. Akinsinde, S. Zastrow, S. Heiderich, W. Toellner, G. Rampelberg, C. Detavernier, J.A.C. Broekaert, K. Nielsch, and J. Bachmann, Adv. Energy Mater. 2, 345 (2012).

    Article  Google Scholar 

  18. R. Rostek, J. Kottmeier, M. Kratschmer, G. Blackburn, F. Goldschmidtböing, M. Kröner, and P. Woias, J. Electrochem. Soc. 160, D408 (2013).

    Article  Google Scholar 

  19. H.P. Nguyen, J. Su, Z. Wang, R.J.M. Vullers, P.M. Vereecken, and J. Fransaer, J. Mater. Res. 26, 1953 (2011).

    Article  Google Scholar 

  20. W. Glatz, E. Schwyter, L. Durrer, and C. Hierold, J. Microelectromech. Syst. 18, 763 (2009).

    Article  Google Scholar 

  21. A. Muto, D. Kraemer, Q. Hao, Z.F. Ren, and G. Chen, Rev. Sci. Instrum. 80, 093901 (2009).

    Article  Google Scholar 

  22. P. Heo, K. Hagiwara, R. Ichino, and M. Okido, J. Electrochem. Soc. 154, C213 (2006).

    Article  Google Scholar 

  23. C. Boulanger, J. Electron. Mater. 39, 1818 (2010).

    Article  Google Scholar 

  24. Q. Huang, A.J. Kellock, and S. Raoux, J. Electrochem. Soc. 155, D104 (2008).

    Article  Google Scholar 

  25. J.L. Lensch-Falk, D. Banga, P.E. Hopkins, D.B. Robinson, V. Stavila, P.A. Sharma, and D.L. Medlin, Thin Solid Films 520, 6109 (2012).

    Article  Google Scholar 

  26. J.H. Lim, M.Y. Park, D.C. Lim, B. Yoo, J.H. Lee, N.V. Myung, and K.H. Lee, J. Electron. Mater. 40, 1321 (2011).

    Article  Google Scholar 

  27. I.J. Yoo, Y. Song, D.C. Lim, N.V. Myung, K.H. Lee, M. Oh, D. Lee, Y.D. Kim, S. Kim, Y.H. Chao, J.Y. Lee, K.H. Lee, and J.H. Lim, J. Mater. Chem. A 1, 5430 (2013).

    Article  Google Scholar 

  28. J.P. Schaffer, A. Saxena, S.D. Antolovich, T.H. Sanders Jr., and S.B. Warner, The Science and Design of Engineering Materials, Int ed. (Chicago: Irwin, 1995), p. 463.

    Google Scholar 

  29. D.D.L. Chung, Appl. Therm. Eng. 21, 1593 (2001).

    Article  Google Scholar 

  30. M.J. Donachi, Titanium: A Technical Guide, 2nd ed. (Metals Park: ASM International, 2000), p. 5.

    Google Scholar 

  31. L.M. Goncalves, C. Couto, P. Alpuim, A.G. Rolo, F. Völkein, and J.H. Correia, Thin Solid Films 518, 2816 (2010).

    Article  Google Scholar 

  32. N.W. Park, W.Y. Lee, J.E. Hong, T.H. Park, S.G. Yoon, H. Im, H.S. Kim, and S.K. Lee, Nanoscale Res. Lett. 10, 20 (2015).

    Article  Google Scholar 

  33. G.H. Dong, Y.J. Zhu, and L.D. Chen, J. Mater. Chem. 20, 1976 (2010).

    Article  Google Scholar 

  34. J.P. Schaffer, A. Saxena, S.D. Antolovich, T.H. Sanders Jr., and S.B. Warner, The Science and Design of Engineering Materials, Int ed. (Chicago: Irwin, 1995), p. 577.

    Google Scholar 

Download references

Acknowledgements

This work was supported by the Basic Science Research Program of the National Research Foundation of Korea (Project No.: 2014R1A1A2004630). The authors are thankful that Dr. Jung and Prof. Ha provided their experimental assistance for preparing LED chips.

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, Hongik University, Seoul, 121-791, Republic of Korea

    Jae-Hwan Kim, Woo-Jun Kim & Tae-Sung Oh

Authors
  1. Jae-Hwan Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Woo-Jun Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tae-Sung Oh
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Tae-Sung Oh.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kim, JH., Kim, WJ. & Oh, TS. Thermoelectric Thin Film Devices for Energy Harvesting with the Heat Dissipated from High-Power Light-Emitting Diodes. J. Electron. Mater. 45, 3410–3417 (2016). https://doi.org/10.1007/s11664-016-4485-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-016-4485-6

Keywords

Search

Navigation