Abstract
In this paper, the microstructural evolution and properties of Au-20wt.%Sn|Ni reaction couples were investigated from two perspectives: (1) by analyzing the microstructure of the as-soldered and aged samples, as well as (2) by measuring the mechanical properties of the intermetallic compounds formed within the reaction zone. The evolution of interfacial reaction products for both the as-soldered and aged interconnections was rationalized by using the experimental results in combination with assessed thermodynamic data from the Au-Ni-Sn system. Moreover, nanoindentation tests were implemented to measure the indentation modulus and hardness of the compounds formed at the interface. It was found that aging had a negligible influence on the elastic modulus and hardness of AuSn and Au5Sn, while the solubility of the third element significantly changed the indentation modulus and hardness of the intermetallic compounds.
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Dong, H., Vuorinen, V., Liu, X. et al. Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection. J. Electron. Mater. 45, 566–575 (2016). https://doi.org/10.1007/s11664-015-4152-3
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DOI: https://doi.org/10.1007/s11664-015-4152-3