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The Effect of Texture on the Hall-Petch Relationship in Severely Drawn Ni-Co Microwires

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Abstract

The influence of texture on strength was investigated by altering the amount of cobalt in Ni-Co alloys. The purpose of incorporating Co was to reduce the stacking fault energy (SFE) of the alloy. A decrease in the SFE reduces the ease of cross-slip and enhances planar slip, leading to changes in texture during cold working. Three Ni-Co alloys (33, 50, and 60 wt pctCo) were wire drawn at room temperature in a specially designed setup to wire diameters of 500, 200, and 100 μm, corresponding to a drawing strain of 2.67, 4.05, and 5.88. EBSD analysis revealed a refinement in grain size with drawing strain as well as a transition from elongated to equiaxed grains in Ni-50 and Ni-60 Co alloys. Line profile analysis and bulk texture analysis showed that increasing drawing strain leads to a higher defect density, an increased <100> fiber fraction and a decreased <111> fiber fraction, with the trends increasing with an increase in Co content. Tensile tests on the drawn wires show that Ni-60 Co alloy has higher strength with superior ductility for all wire diameters. The HP coefficients for the annealed conditions, calculated by annealing Ni-Co wires of 100 μm diameter, was found to be independent of SFE. The HP coefficients in drawn conditions were found to be higher than in the annealed conditions. The activation volume measured from the multiple stress relaxations in the drawn wires ranged from 20 to 5.5 b3, suggesting that dislocation interactions remained the underlying operating deformation mechanism.

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Acknowledgment

The work was supported by science and engineering research board (SERB), department of science and technology, Government of India.

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The authors declare that they have no known financial competing interests or personal relationships that could have influenced the work reported in the manuscript.

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Authors and Affiliations

  1. Department of Materials Engineering, Indian Institute of Science, Bengaluru, 560012, India

    Girish Bojjawar, Satyam Suwas & Atul H. Chokshi

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  1. Girish Bojjawar
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  2. Satyam Suwas
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Correspondence to Girish Bojjawar.

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Appendices

Appendix

See Figure A1.

Fig. A1
figure 7

Misorientation boundary fraction in drawn (a) Ni-33Co, (b) Ni-50Co, (c) Ni-60Co, and (d) Ni-Co wire of 100 μm diameter. Misorientation with < 5, 5-15, and > 15 deg are consider as low angle, medium, and high angle grain boundaries

Full size image

Microstructure of annealed Ni-Co wires

See Figures A2, A3, A4, and Table AI.

Fig. A2
figure 8

Microstructures along with inverse pole figures for annealed Ni-33 Co wire of 100 µm with grain sizes (a) 3.93 ± 0.37 μm, (b) 4.45 ± 0.37 μm , and (c) 6.40 ± 0.47 μm after annealing

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Fig. A3
figure 9

Microstructures along with inverse pole figures for annealed Ni-50 Co wire of 100 µm with grain sizes (a) 2.15 ± 0.11 μm, (b) 3.50 ± 0.24 μm and (c) 5.49 ± 0.44 μm

Full size image
Fig. A4
figure 10

Microstructures along with inverse pole figures of annealed Ni-60 Co wire of 100 µm with grain sizes (a) 5.06 ± 0.32 μm, (b) 7.3 ± 0.67 μm, and (c) 9.66 ± 0.91 μm. (d) Standard inverse pole figure of pure Ni

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Table AI Heat Treatment Details, Grain Sizes with Standard Error, Twin Fraction, and CSL Boundary Fraction in Annealed Ni-Co Wires
Full size table

Tensile Test Data of Ni-Co Annealed Wires

See Figure A5.

Fig. A5
figure 11

Tensile test results for annealed Ni-Co alloys, (a) Ni-33Co, (b) Ni-50Co and (c) Ni-60 Co

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Bojjawar, G., Suwas, S. & Chokshi, A.H. The Effect of Texture on the Hall-Petch Relationship in Severely Drawn Ni-Co Microwires. Metall Mater Trans A 55, 232–246 (2024). https://doi.org/10.1007/s11661-023-07245-z

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