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The Effect of Aging on the Microstructure of Selective Laser Melted Cu-Ni-Si

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A Correction to this article was published on 13 November 2017

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Abstract

Precipitation hardening copper alloy C70250 was selectively laser melted to successfully produce components around 98 pct dense with high mechanical strength and electrical conductivity. Aging heat treatments were carried out at 723 K (450 °C) directly on as-printed samples up to 128 hours. Mechanical testing found that peak yield strength of around 590 MPa could be attained with an electrical conductivity of 34.2 pct IACS after 8 hours of aging. Conductivity continues to increase with further aging while the peak strength appears to be less sensitive to aging time exhibiting a broad range of time where near-peak properties exist. After aging for 128 hours, there is a drop in yield strength to 546 MPa with an increase in conductivity to 43.2 pct IACS. Electron microscopy analysis revealed nanometer-scale silicon-rich oxide particles throughout the material that persist during aging. Deformation twinning is observed in the peak-age condition after tensile testing and several strengthening mechanisms appear to be active to varying degrees throughout aging which account for the broad range of aging time where nearly the peak mechanical properties exist.

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Change history

  • 13 November 2017

    In the Experimental Methods section, second paragraph, last sentence of the original article the value for the resistivity of pure copper is incorrect. The correct value is 1.7241 µΩ-cm.

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Acknowledgments

The authors would like to thank TE Connectivity, ltd. for the funding of this research along with collaboration throughout the study. The authors thank the Loewy Family Foundation for financially supporting this project and two of the authors, (Anthony P. Ventura) as a Loewy Graduate Fellow and (Wojciech Z. Misiolek) through the Loewy Professorship at Lehigh University. Lastly, the authors thank the W. M. Keck Foundation for financial support of Dr. Christopher J. Marvel.

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Authors and Affiliations

  1. Materials Science and Engineering Department, Loewy Institute, Lehigh University, Bethlehem, PA, 18015, USA

    Anthony P. Ventura & Wojciech Z. Misiolek

  2. Pratt & Whitney, Materials & Processes Engineering, East Hartford, CT, 06118, USA

    Anthony P. Ventura

  3. Materials Science and Engineering Department, Lehigh University, Bethlehem, PA, 18015, USA

    Christopher J. Marvel, Masashi Watanabe & Richard P. Vinci

  4. Tyco Electronics Corporation, A TE Connectivity company, Harrisburg, PA, 17111, USA

    Gregory Pawlikowski & Martin Bayes

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  1. Anthony P. Ventura
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  2. Christopher J. Marvel
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  5. Masashi Watanabe
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Correspondence to Anthony P. Ventura.

Additional information

Manuscript submitted May 9, 2017.

A correction to this article is available online at https://doi.org/10.1007/s11661-017-4395-0.

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Ventura, A.P., Marvel, C.J., Pawlikowski, G. et al. The Effect of Aging on the Microstructure of Selective Laser Melted Cu-Ni-Si. Metall Mater Trans A 48, 6070–6082 (2017). https://doi.org/10.1007/s11661-017-4363-8

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