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Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica

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Abstract

The rising demand for precision optics widely employed in ground and space-based astronomical instruments and other scientific instrumentation requires highly efficient advanced fabrication methods. Due to complex-shaped fused silica substrate surfaces like freeform or aspheres with strong curvatures or very small-sized components, a novel non-contact medium-pressure plasma-based method is developed to finish optical components. The present study critically compares the polished optical surfaces of a prism with a medium-pressure plasma process and wet chemical etching to provide insight into their smoothing. The results show that surface roughness (Ra) increases from 0.54 to 2.61 nm and 0.53 to 0.57 nm at 5 and 20 mbar total pressures, respectively, using a plasma process without surface contamination. However, wet chemical etching increases surface roughness (Ra) from 0.52 to 15.9 nm. The substrates' surface morphology, elemental composition, and surface topography are analyzed using FESEM, EDX, and AFM. Moreover, subsurface improvements are analyzed using Raman spectroscopy analysis.

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Data Availability

Data will be made available on request.

Abbreviations

FESEM :

Field emission scanning electron microscopy

EDX:

Energy dispersive X-ray

AFM:

Atomic force microscopy

R a :

Surface roughness

UVL:

Ultraviolet lithography

EUVL:

Extreme ultraviolet lithography

APPP:

Atmospheric pressure plasma polishing

RF:

Radio-frequency

PJM:

Plasma jet machining

PAMM:

Plasma-induced atom migration manufacturing

MPPP:

Medium-pressure plasma polishing

MRR:

Material removal rate

LIDT:

Laser-induced damage threshold

OES:

Optical emission spectrometer

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Acknowledgements

We thank the Science and Engineering Research Board, New Delhi, India, for its financial support of project No. E.C.R./2018/002801 titled "Design and development of a novel plasma processing set up for uniform nanopolishing of prism and any freeform surfaces of fused silica."

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HNSY: Conceptualization, Methodology, Data curation, Investigation, Writing—review & editing. MD: Supervision, Writing—review & editing.

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Correspondence to Manas Das.

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Yadav, H.N.S., Das, M. Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica. Plasma Chem Plasma Process 44, 1083–1104 (2024). https://doi.org/10.1007/s11090-024-10447-x

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