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Surface Treatment of Polyimide Substrates Using Dielectric Barrier Discharge Reactors Based on L-Shaped Electrodes

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Abstract

Two dielectric barrier discharge reactors, based on L-shaped electrodes, were designed and fabricated for in-line surface treatment of polyimide (PI) substrates. Under homogeneous discharge mode, their surface treatment performance was evaluated in terms of water contact angles (WCAs) of PI film. Hydrophilicity of polymer films arises from the grafting of functional groups onto the polymer’s surface by O and N radicals. In our reactor, ambient air could be entrained into the discharge region, such that the WCA of PI film was effectively lowered without adding O2 or N2 gas. The PI film WCA decreased with increased applied voltage or with decreased motion speed of the substrate. A serial connection of the electrode lowered the WCA, whereas O2 addition only weakly affected the PI film hydrophilicity. The mechanisms underlying these phenomena were analyzed using the discharge current, the temporal and time-averaged discharge images, and the optical emission profiles.

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Acknowledgments

This work was supported by the Development Program of Manufacturing Technology for Flexible Electronics with High Performance funded by Korea Institute of Machinery and Materials (KIMM).

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Authors and Affiliations

  1. Plasma Engineering Laboratory, Korea Institute of Machinery and Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon, 305-343, Republic of Korea

    M. Hur, W. S. Kang, J. O. Lee & Y. H. Song

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  1. M. Hur
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  2. W. S. Kang
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  3. J. O. Lee
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  4. Y. H. Song
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Correspondence to M. Hur.

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Hur, M., Kang, W.S., Lee, J.O. et al. Surface Treatment of Polyimide Substrates Using Dielectric Barrier Discharge Reactors Based on L-Shaped Electrodes. Plasma Chem Plasma Process 35, 231–246 (2015). https://doi.org/10.1007/s11090-014-9598-1

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  • DOI: https://doi.org/10.1007/s11090-014-9598-1

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