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Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion

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Abstract

Electroless plating is a promising method to achieve material surface metallization, low rupture work of plated coating and complex production processes have become important factors that restrict its progress. In this study, a facile method combined with primer modification (mixture of SiO2 particle and resin) and electroless deposition to fabricate a high-adhesion Cu-plated coating is demonstrated. Results showed that poly(ethylene terephthalate) (PET) modified with primer could absorb Ag+ through the coordination effect because hydrophilic groups (–OH and –NH2) were possibly used as a bridge for chemisorbing of rare metal ions (Ag+) through ion exchange, which acted as a catalyst for the deposition of Cu coating on its surface. More importantly, introducing SiO2 particles in the primer can improve surface roughness, which is enhanced from 0.643 to 0.829 μm of modified coating, result in the improvement of substrate/deposited coating contact area, which would facilitate the enhancement of the adhesion behavior of plated coating. The deposition of bead-like structure Cu coating on primer-modified PET surface with a higher average roughness value possessed excellent electrical property, adhesion and crystallization. The resistivity of the copper patterns is approximately 9.81 × 10−6 Ω·cm. It is promising to integrate this kind of metal material with excellent performance in future flexible devices.

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The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Authors and Affiliations

  1. National Synchrotron Radiation Laboratory, University of Science and Technology of China, Hefei City, 230029, People’s Republic of China

    Yulei liu & Liangbin Li

  2. Hefei Lucky & Technology Industry Co. Ltd, Hefei City, 230041, People’s Republic of China

    Yulei liu, Haichao Qi, Changfeng Liu, Chao Li & Jingbin Hou

  3. School of Energy Materials and Chemical Engineering, Hefei University, Hefei City, 230601, People’s Republic of China

    Xinke Zhao

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  1. Yulei liu
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by LYL and HCQ. The first draft of the manuscript was written by LYL and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript. JBH and LBL Conceptualization, data curation, writing-review and editing, validation, supervision.

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Correspondence to Liangbin Li.

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liu, Y., Qi, H., Liu, C. et al. Rationally design of substrate surface topography toward the improvement of Cu-plated coating adhesion. J Mater Sci: Mater Electron 35, 374 (2024). https://doi.org/10.1007/s10854-024-11985-y

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