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EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder

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Abstract

Electronic applications are now driving packaging technology that is equivalent to primary computer packages for the past 25 years. The electronic application currently shows an ascending market demand due to rapid development of smart and wireless component with mixed technologies that include digital microprocessors. In ensuring the quality of the devices, the reliability of the solder joint is very vital. Attributable to their common uses, radiation particles including gamma ray is considered as one of the primary factors that could degrade the performance of the electronic devices. Thus, in this study, both mechanical and microstructure properties of lead-free solder joints radiated with gamma were investigated. Prior to the evaluation, the solder pastes of tin–silver–copper (SnAg3Cu0.5; SAC305) was manually deposited on the printed circuit board using a stencil printing method and reflow soldering process. Subsequently, the solder was exposed to low doses of gamma radiation. The current finding showed that as the radiation dose increased, the solder sample became softer and more plastic. FESEM and EDS analysis signified that intermetallic layer in the tin (Sn) matrix was dominated by Cu6Sn5 and Ag2Sn compound. According to micromechanical investigation, both hardness and reduced modulus of the solder decreased with increasing the radiation dose that was due to microstructure change and the formation of voids.

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Acknowledgements

This research was fully supported by Fundamental Research Grant Scheme, FRGS/1/2018/STG07/UPNM/02/1. The authors would like to acknowledge Ministry of Higher Education (MOHE) and National Defence University of Malaysia for the approved fund in ensuring this important research viable and effective. The authors would also like to appreciate Universiti Kebangsaan Malaysia and RedRing Solder (M) Sdn. Bhd. for providing the research materials and collaboration work.

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Authors and Affiliations

  1. Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, 57000, Kuala Lumpur, Malaysia

    Nur Farisa Nadia Mohmad Lehan, Wan Yusmawati Wan Yusoff & Azuraida Amat

  2. Faculty of Engineering, Universiti Pertahanan Nasional Malaysia, 57000, Kuala Lumpur, Malaysia

    Normidatul Salwa Sobri, Ku Zarina Ku Ahmad & Mohamad Faizal Abdullah

  3. Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia

    Azman Jalar

  4. School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia

    Irman Abdul Rahman

  5. Department of Mineral and Geoscience Malaysia, Mineral Research Centre, Jalan Sultan Azlan Shah, 31400, Ipoh, Perak, Malaysia

    Emee Marina Salleh

Authors
  1. Nur Farisa Nadia Mohmad Lehan
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  2. Wan Yusmawati Wan Yusoff
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  3. Normidatul Salwa Sobri
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  4. Ku Zarina Ku Ahmad
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  6. Azuraida Amat
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  7. Azman Jalar
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  9. Emee Marina Salleh
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Contributions

WYWY, KZKA, MFA and AA conceived, designed the study, and conducted the literature search. NFNML, WYWY, NSS, AJIAR and EMS were involved in the analysis and interpretation of data. NFNML, NSS, WYWY and KZKA drafted the manuscript. The study was supervised by WYWY and KZKA. All authors have accepted responsibility for the entire content of this manuscript and approved of its submission.

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Correspondence to Wan Yusmawati Wan Yusoff.

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Lehan, N.F.N.M., Yusoff, W.Y.W., Sobri, N.S. et al. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder. J Mater Sci: Mater Electron 33, 4225–4236 (2022). https://doi.org/10.1007/s10854-021-07617-4

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  • DOI: https://doi.org/10.1007/s10854-021-07617-4

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