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Microstructural evolution of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder joints induced by variation doses of gamma-irradiation

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Abstract

Sn-Ag-Cu-based solder alloys are extensively employed in electronic packaging applications, thus necessitating in-depth reliability studies in various environmental conditions. This study investigated the microstructural evolution characteristics of gamma-irradiated 96.5Sn3.0Ag0.5Cu (SAC305) solder joints under varied gamma doses. The findings in this study involved the primary phase beta Sn (β-Sn) and near eutectic phase distributions, intermetallic compound (IMC) layer thickness, and micro-crack occurrences. Therefore, notable phase formation changes in the β-Sn and near eutectic phase distributions occurred following the microstructure changes in the gamma-irradiated solder alloy. Although the SAC305 solder matrix did not demonstrate any new structural phases, the higher radiation exposures increased the β-Sn and Ag3Sn peak intensities. Furthermore, the microstructure analysis presented a higher near eutectic phase percentage upon initial gamma radiation exposure from 5 to 15 Gy, gradually decreasing from 20 to 50 Gy. The IMC layer thickness was also positively correlated with the gamma doses, while the micro-cracks near the IMC layer-solder bulk interface were evident. Consequently, the microstructural evolution varied under different gamma radiation levels, demonstrating a profound correlation to the mechanical properties of the SAC305 solder joints.

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Acknowledgements

This research was fully supported by the Tabung Amanah PPPI grant (UPNM/2023/GPPP/SG/1). The authors thank Universiti Pertahanan Nasional Malaysia (UPNM) for funding this study.

Funding

This research was fully supported by the Tabung Amanah PPPI grant (UPNM/2023/GPPP/SG/1).

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Authors and Affiliations

  1. Department of Physics, Centre for Defence Foundation Studies, Universiti Pertahanan Malaysia, Kem Sungai Besi, 57000, Kuala Lumpur, Malaysia

    Norliza Ismail, Wan Yusmawati Wan Yusoff, Nur Farisa Nadia Mohmad Lehan, Nor Azlian Abdul Manaf, Azuraida Amat & Nurazlin Ahmad

  2. Malaysian Nuclear Agency, 43000, Bangi, Kajang, Selangor, Malaysia

    Wilfred Paulus

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Contributions

All authors contributed to the study of conception, design, and visualization. NI, WYWY, NFN, and WP: performed material preparation, data collection, and analysis. NI: wrote the first draft of the manuscript, and all authors commented on previous versions. All authors have read and approved the final manuscript.

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Correspondence to Wan Yusmawati Wan Yusoff.

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Ismail, N., Yusoff, W.Y.W., Lehan, N.F.N.M. et al. Microstructural evolution of 96.5Sn-3.0Ag-0.5Cu (SAC305) solder joints induced by variation doses of gamma-irradiation. J Mater Sci: Mater Electron 35, 18 (2024). https://doi.org/10.1007/s10854-023-11749-0

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