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Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

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Abstract

With the requirement of lead-free soldering technology in electronic industry for manufacturing lead-free electronic devices, Au80Sn20 solder has been developed and applied in high-power devices due to its excellent physical and chemical properties. However, the application of new type of chip in high-power devices leads to the exposure of the Au80Sn20 solder joints to the complex environment of temperature cycle and current switch cycle, which seriously affects the reliability of solder joints in practical applications. In this study, the solder joint structure and simulation platform were designed independently. The failure mechanism of Au80Sn20/AlN substrate solder joint under temperature cycle and current switch cycle was studied by analyzing the changes in morphological characteristics of solder joint and composition in different working times. It was found that the failure process of solder joint involved the generation of steps along the grain boundary and phase boundary, and the failure was caused by the gradual expansion of steps. Owing to the uneven distribution of Cu and Ni in Au5Sn and AuSn phases, the volume difference among different phases was generated, which promoted the formation of phase boundary steps. The grain boundary steps were formed due to the formation of Au3Cu phase at the grain boundary, resulting in the volume difference between grain boundary and grain. Based on the research results, the idea of improving solder joint reliability by adjusting microstructure of Au80Sn20 solder is put forward, which plays a theoretical guiding role in the optimization of targeted performance of Au80Sn20 solder.

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References

  1. R.K. Ulrich, W.D. Brown, Advanced Electronic Packaging, 2nd edn. (China Machine Press, Beijing, 2010), pp. 518–521

    Google Scholar 

  2. X.Y. Zhou, Appl. IC 35, 6 (2018). https://doi.org/10.19339/j.issn.1674-2583.2018.06.001

    Article  Google Scholar 

  3. Y.C. Peng, Research on the Failure Mechanism and Reinforcement Technology of an IC Chip (XDU, Xian, 2019), pp. 25–30

    Google Scholar 

  4. Y.W. Chang, C.C. Hu, H.Y. Peng, Y.C. Liang, C. Chen, T.C. Chang, C.J. Zhang, J.Y. Juang, Sci. Rep. (2018). https://doi.org/10.1038/s41598-018-23809-1

    Article  Google Scholar 

  5. C. Ho, P.T. Lee, C.N. Chen, C.H. Yang, J. Alloys Compd. 676, 134 (2016). https://doi.org/10.1016/j.jallcom.2016.03.134

    Article  CAS  Google Scholar 

  6. L.J. Wang, S.B. Xue, H. Liu, Y.W. Lin, H.N. Chen, Mater. Rep. 33, 2483 (2019). https://doi.org/10.11896/cldb.18080163

    Article  Google Scholar 

  7. T.K. Lee, T.R. Bieler, C.U. Kim, H. Ma, Fundamentals of Lead-Free Solder Interconnect Technology (Springer, New York, 2015), pp. 1–20

    Google Scholar 

  8. K. Yamanaka, Y. Tsukada, K. Suganuma, Microelectron. Reliab. 47, 8 (2006). https://doi.org/10.1016/j.microrel.2006.09.028

    Article  CAS  Google Scholar 

  9. M.L. Huang, L.D. Chen, S.M. Zhou, Acta Metall. Sin. 48, 3 (2012). https://doi.org/10.7498/aps.61.198104

    Article  Google Scholar 

  10. Zuo Yong, Creep and thermomechanical fatigue behaviors of lead-free solder joint under high current density (Beijing University of Technology, Beijing, 2017), pp. 49–78.

  11. J.W. Evans, A Guide to Lead–free Solders (Springer-Verlag, London, 2007), pp. 187–202

    Book  Google Scholar 

  12. X.Y. Zeng, Y.Z. Ma, W.S. Liu, Y.F. Huang, S.W. Tang, B.S. Chen, Mater. Res. Express 6, 7 (2019). https://doi.org/10.1088/2053-1591/ab15e7

    Article  CAS  Google Scholar 

  13. IPC-4552, Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards (Northbrook, America, 2001).

  14. GJB 548B-2005, Test methods and procedures for microelectronic device (China, 2005).

  15. N. Jiang, L. Zhang, M.Y. Xiong, M. Zhao, P. He, Electr. Comp. Mater. 38, 8 (2019). https://doi.org/10.14106/j.cnki.1001-2028.2019.08.001

    Article  Google Scholar 

  16. J.Y. Tsai, C.W. Chang, C.E. Ho, J. Electron. Mater. 35, 1 (2006). https://doi.org/10.1007/s11664-006-0185-y

    Article  Google Scholar 

  17. X.F. Wei, Preparation and Related Fundamental Research on AuSn20 Eutectic Solder for Electronic Packaging (CSU, Changsha, 2013), pp. 5–13

    Google Scholar 

  18. Department of inorganic chemistry, DLUT, Inorganic Chemistry (Higher Education Press, Beijing, 2006)

    Google Scholar 

  19. Y.L. Tian, First principles study of the properties of Sn-based interfacial intermetallics (TJU, Tianjin, 2017), pp. 31–44

    Google Scholar 

  20. O.B. Karlsen, A. Kjekshus, E. Rost, Acta Chem. Scand. 44, 2 (1992). https://doi.org/10.3891/acta.chem.scand.46-0147

    Article  Google Scholar 

  21. G.X. Hu, Fundamentals of Materials Science (SJTU Press, Shanghai, 2010)

    Google Scholar 

  22. W.S. Liu, Y.F. Huang, Y.Z. Ma, Mater. Rep. 27, 11 (2013)

    CAS  Google Scholar 

Download references

Acknowledgements

This work is supported by China Postdoctoral Science foundation founded project (Grant No. BX20190066) and China Postdoctoral Science foundation founded project (Grant No. 2020M671288).

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Authors and Affiliations

  1. National Key Laboratory of Science and Technology for National Defence on High–strength Structural Materials, Central South University, Changsha, 410083, China

    Ping Lin, Wensheng Liu, Yunzhu Ma, Yufeng Huang & Siwei Tang

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  1. Ping Lin
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  2. Wensheng Liu
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  3. Yunzhu Ma
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  4. Yufeng Huang
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  5. Siwei Tang
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Correspondence to Yufeng Huang.

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Lin, P., Liu, W., Ma, Y. et al. Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests. J Mater Sci: Mater Electron 31, 19013–19024 (2020). https://doi.org/10.1007/s10854-020-04438-9

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