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Preparation of gold-decorated silver nanowires for improving conductivity of electrically conductive adhesives

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Abstract

Excellent electrical conductivity generally conflicts with high lap shear strength for electrically conductive adhesives (ECAs). One-dimensional silver nanowires (AgNWs) as conductive fillers can effectively solve the problem. However, insulating ligands on the nanowires will form a large contact resistance between the nanowires and limit the electrical conductivity of ECAs. In this work, we reported a one-step method to prepare Au-decorated AgNW conductive fillers. Through controlling the filler content, curing temperature, and curing time, the ECAs filled with Au-decorated AgNWs obtained exceptional electrical performance. When the filler content was 39 wt%, the resistivity reached to 7.8 × 10−5 Ω cm, which had a strong competitiveness to tin–lead solder. Therefore, the feature opens up possibilities for ECAs filled with the hybrid nanofiller to completely replace traditional solder.

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Authors and Affiliations

  1. School of Reliability and Systems Engineering, Beihang University, Beijing, 100191, China

    Jing Lu

  2. China Academy of Aerospace Standardization and Product Assurance, Beijing, 100071, China

    Tianlong Han

  3. Shengyang 4435 Microelectronics Co. Ltd., Shengyang, 110034, China

    Junfu Dai

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  1. Jing Lu
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  2. Tianlong Han
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  3. Junfu Dai
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Correspondence to Jing Lu or Junfu Dai.

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Lu, J., Han, T. & Dai, J. Preparation of gold-decorated silver nanowires for improving conductivity of electrically conductive adhesives. J Mater Sci: Mater Electron 31, 14601–14607 (2020). https://doi.org/10.1007/s10854-020-04022-1

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