Abstract
Rapid heat dissipation is the pain point of modern miniaturized electronic equipment and components. High-power and high-efficiency operation puts forward higher requirements on the heat transfer capability of thermal interface materials (TIM). In this work, taking advantage of synergistic effect between thermally conductive fillers graphene and alumina (Al2O3), thermal grease-based TIM was prepared. Secondly, the effects of temperature and pressure on the thermal interface resistance were studied. Lastly, coating thickness and thermal stability of thermal grease-based TIM were tested. These results show thermal conductivity of composite as high as 4.38 W/(m K). The interface thermal resistance is as low as 0.243 °C cm2/W (80 °C, 60 psi) in case that the temperature and pressure strain capability within a certain range are subsequently considerable. Furthermore, the oil leakage is fractional when the silicone grease was placed at 80 °C for 600 h, showing good thermal stability.
Similar content being viewed by others
References
R. Gordon, Transl. Mater. Res. 2, 020301 (2015)
R.A. Shishkin, A.P. Zemlyanskaya, A.R. Beketov, Solid State Phenom. 284, 48 (2018)
S. Shaikh, K. Lafdi, E. Silverman, Carbon 45, 69 (2007)
J. Yang, S. Wang, H. Chen, Int. J. Heat Mass Transf. 97, 146 (2016)
D.M. Bi, Cryogenics 24, 46 (2011)
A.J. Mcnamara, Y. Joshi, Z.M. Zhang, Int. J. Therm. Sci. 62, 2 (2012)
J. Due, A.J. Robinson, Appl. Therm. Eng. 50, 455 (2013)
K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Alam, E.H. Amalu, Microelectron. Reliab. 51, 2031 (2011)
R. Prasher, Proc. IEEE 94, 1571 (2006)
A. Gowda, D. Esler, S.N. Paisner, S. Tonapi, K. Nagarkar, K. Srihari, IEEE Semiconductor Thermal Measurement & Management Symposium. (2005)
X. Huang, P. Jiang, T. Tanaka, IEEE Electr. Insul. Mag. 27, 8 (2011)
B.L. Zhu, J. Ma, J. Wu, K.C. Yung, C.S. Xie, J. Appl. Polym. Sci. 118, 2754 (2010)
K. Kim, J. Kim, Ceram. Int. 40, 5181 (2014)
L.C. Sim, S.R. Ramanan, H. Ismail, K.N. Seetharamu, T.J. Goh, Thermochim. Acta 430, 155 (2005)
S. Kemaloglu, G. Ozkoc, A. Aytac, Thermochim. Acta 499, 40 (2010)
C. Chen, Y.Q. Xia, J.H. Chen, China Adhes. 26, 42 (2017)
Q. Wang, W. Gao, Z. Xie, J. Appl. Polym. Sci. 89, 2397 (2003)
A. Gowda, S.N. Paisner, S. Tonapi, P. Meneghetti, P. Hans, G. Strosaker, A. Acharya, K. Nagarkar, K. Srihari, Electronic Packaging Technology Conference. IEEE. (2006)
Y. Gao, J. Liu, Appl. Phys. A 107, 701 (2012)
H. Hong, G. Christensen, C. Widener, Procedia Manuf. 21, 623 (2018)
B.L. Wadey, J. Vinyl Addit. Technol. 9, 172 (2010)
G.F. Xie, D. Ding, G. Zhang, Adv. Phys. 3, 719 (2018)
C.Q. Liu, M. Chen, W. Yu, Y. He, ES Energy Environ. 2, 31 (2018)
A.A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweldebrhan, F. Miao, C.N. Lau, Nano Lett. 8, 902 (2008)
D.H. Zhu, G.W. Huang, L.Y. Zhang, Y. He, H.Q. Xie, W. Yu, Energy Environ. Mater. 2, 22 (2019)
American Society for Testing Materials, method D5470-06 (2006)
Z.Y. Wei, J.K. Yang, W.Y. Chen, K.D. Bi, D.Y. Li, Y.F. Chen, Appl. Phys. Lett. 104, 081903 (2014)
Acknowledgements
The work was supported by National Natural Science Foundation of China (51590902 & 51876112), the Key Subject of Shanghai Polytechnic University (Material Science and engineering; Grant Nos. XXKZD1601 and EGD18YJ0024), Hunan Provincial Natural Science Fund (2018JJ3478) and the Key projects of Hunan Provincial Education Department (no. 19A448).
Author information
Authors and Affiliations
Corresponding authors
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Chen, C., He, Y., Liu, C. et al. Comprehensive excellent performance for silicone-based thermal interface materials through the synergistic effect between graphene and spherical alumina. J Mater Sci: Mater Electron 31, 4642–4649 (2020). https://doi.org/10.1007/s10854-020-03016-3
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-020-03016-3