Abstract
The rapid development of modern information technology needs highly thermal-conductive with high-frequency copper clad laminates (HFCCLs) as a key point. In this study, ShBN (spherical hexagonal boron nitride) and ShBN/KH550 (surface modified by KH550) were used as fillers to enhance the thermal conductivity for the insulating layer of HFCCLs. Due to the merits of not only the rotational symmetry for effective thermal networks, but also a compatibility with the polymer matrix, the ShBN/KH550 filled with HFCCLs (SK-CCLs) could reach a high value of 1.18 W m−1K−1 when the content of the filler was 63 wt%. On the other hand, the incorporation of ShBN and ShBN/KH550 fillers had led to the decrease the dielectric losses with a low dielectric permittivity even at a high testing frequency of 5 GHz. In addition, the peel strength and flexural strength of the HFCCLs were not significantly reduced with the addition of either ShBN or ShBN-KH550 fillers, showing the same downward trend. This study presents a new direction to promote the conductive insulating layer for HFCCLs to meet the high requirement of upcoming 5G or 6G era.
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References
Y.H. Kim, Y.W. Lim, Y.H. Kim, B.S. Bae, Thermally stable siloxane hybrid matrix with low dielectric loss for copper-clad laminates for high-frequency applications. ACS Appl. Mater. Interfaces 8, 8335–8340 (2016)
S. Zhu, A. Gu, G. Liang, Y. Li, Dielectric properties and their dependence of polyetherimide/bismaleimide blends for high performance copper clad laminates. J. Polym. Res. 18, 1459–1467 (2011)
Z. Zhang, L. Yuan, G. Liang, A. Gu, Fabrication and origin of flame retarding glass fiber/bismaleimide resin composites with high thermal stability, good mechanical properties, and a low dielectric constant and loss for high frequency copper clad laminates. RSV Adv. 6, 19638–19646 (2016)
Y. Jiang, X. Shi, Y. Feng, S. Li, X. Zhou, X. Xie, Enhanced thermal conductivity and ideal dielectric properties of epoxy composites containing polymer modified hexagonal boron nitride. Compos. Part A 107, 657–664 (2018)
T.Y. Tsai, B. Naveen, C. Huang, Y.S. Huang, L. Chen, Novolac cured epoxy resin/ fullerenes modified clay composites: applied in copper clad laminate. RSV Adv. 5, 95649–95656 (2015)
G. Rui, A. Gu, G. Liang, S. Dai, Y. Li, Properties and origins of high-performance poly(phenylene oxide)/cyanate ester resins for high-frequency copper-clad laminates. J. Appl. Polym. Sci. 121, 1675–1684 (2011)
Y. Zhao, M. Zhou, G. Chen, Z. Zhou, Q. Li, Hybridization of polyhedral oligomeric silsesquioxane and boron nitride for epoxy composites with improved dielectric, thermal and tensile properties. J. Mater. Sci. Mater. El. 30, 10360–10368 (2019)
Y. Zhan, Y. Ren, X. Wan, J. Zhang, S. Zhang, Dielectric thermally conductive and stable poly (arylene ether nitrile) composites filled with silver nanoparticles decorated hexagonal boron nitride. Ceram. Int. 44, 2021–2029 (2018)
L. Weng, Y. Zhang, X. Zhang, L. Liu, H. Zhang, Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates. J. Mater. Sci. Mater. El. 29, 1–10 (2018)
J. Gu, Y. Guo, Z. Lv, W. Geng, Q. Zhang, Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities. Compos. Part A 78, 95–101 (2015)
I. Isarn, F. Gamardella, X. Fernàndez-Francos, À. Serra, F. Ferrando, Thermal conductive composites prepared by addition of several ceramic fillers to thermally cationic curing cycloaliphatic epoxy resins. Polymers 11, 138 (2019)
H. Chen, V.V. Ginzburg, Y. Jian et al., Thermal conductivity of polymer-based composites: fundamentals and applications. Prog. Polym. Sci. 59, 41–85 (2016)
H. Nersisyan, T.H. Lee, K.H. Lee et al., Thermally induced formation of 2D hexagonal BN nanoplates with tunable characteristics. J. Solid State Chem. 225, 13–18 (2015)
B. Zhong, X.H. Tang, X.X. Huang et al., Boron nitride hollow nanospheres: synthesis, formation mechanism and dielectric property. Mater. Res. Bull. 64, 61–67 (2015)
K. Kim, H. Ju, J. Kim, Filler orientation of boron nitride composite via external electric field for thermal conductivity enhancement. Ceram. Int. 42, 8657–8663 (2016)
M. Haruki, J. Tada, K. Tanaka, H. Onishi, Y. Tada, Enhancing the effective thermal conductivity of Kapton-type polyimide sheets via the use of hexagonal boron nitride. Thermochim. Acta 662, 1–7 (2018)
S.G. Mosanenzadeh, S. Khalid, C. Yi, H.E. Naguib, High thermally conductive PLA based composites with tailored hybrid network of hexagonal boron nitride and graphene nanoplatelets. Polym. Compos. 37, 2196–2205 (2016)
T. Ouyang, Y. Chen, Y. Xie, K. Yang, Z. Bao, J. Zhong, Thermal transport in hexagonal boron nitride nanoribbons. Nanotechnology 21, 245701–245706 (2010)
Y. Yao, X. Zeng, K. Guo, R. Sun, J.B. Xu, The effect of interfacial state on the thermal conductivity of functionalized Al2O3 filled glass fibers reinforced polymer composites. Compos. Part A 69, 49–55 (2015)
M.A. Raza, A. Westwood, Thermal contact resistance of various carbon nanomaterial-based epoxy composites developed for thermal interface applications. J. Mater. Sci. Mater. El. 30, 1–9 (2019)
P. Chen, K. Kou, J. Qian, Z. Yu, G. Wu, T. Ji, Improved thermal conductivity and dielectric properties of hBN/PTFE composites via surface treatment by silane coupling agent. Compos. Part B 111, 83–90 (2017)
H.M. Naguib, M.A. Ahmed, Z.L. Abo-Shanab, Silane coupling agent for enhanced epoxy-iron oxide nanocomposite. J. Mater. Res. Technol. 7, S2238785416302551 (2018)
G. Mittal, K.Y. Rhee, S.J. Park, Processing and characterization of PMMA/PI composites reinforced with surface functionalized hexagonal boron nitride. Appl. Surf. Sci. 415, S0169433216321249 (2017)
C. Chen, J. Wang, X. Chen, X. Yu, Q. Zhang, Improvement of thermal conductivities and mechanical properties for polyphthalonitrile nanocomposites via incorporating functionalized h-BN fillers. High Perform. Polym. 31, 294–303 (2019)
M. Wang, H. Le, Y. Yin, Magnetic field guided colloidal assembly. Mater. Today 16, 110–116 (2013)
H.A.M.V. Aert, M.H.P.V. Genderen, G.J.M.L.V. Steenpaal, L. Nelissen, E.W. Meijer, Modified poly(2,6-dimethyl-1,4-phenylene ether)s prepared by redistribution. Macromolecules 30, 6056–6066 (1997)
J. Krijgsman, D. Husken, R.J. Gaymans, Synthesis and properties of thermoplastic elastomers based on PTMO and tetra-amide. Polymer 44, 7573–7588 (2003)
M. Ge, J. Zhang, C. Zhao, C. Lu, G. Du, Effect of hexagonal boron nitride on the thermal and dielectric properties of polyphenylene ether resin for high-frequency copper clad laminates. Mater. Des. 182, 108028 (2019)
H.E. Çamurlu, S. Mathur, O. Arslan, E. Akarsu, Modification of hexagonal boron nitride nanoparticles with fluorosilane. Ceram. Int. 42, 6312–6318 (2016)
A. Mahdizadeh, S. Farhadi, A. Zabardasti, Microwave-assisted rapid synthesis of graphene-analogue hexagonal boron nitride (h-BN) nanosheets and their application for the ultrafast and selective adsorption of cationic dyes from aqueous solutions. RSV Adv. 7, 53984–53995 (2017)
C. Tang, Y. Bando, H. Yang, C. Zhi, D. Golberg, Synthetic routes and formation mechanisms of spherical boron nitride nanoparticles. Adv. Funct. Mater. 18, 3653–3661 (2010)
Y. Zhu, F. Piscitelli, G.G. Buonocore, M. Lavorgna, E. Amendola, L. Ambrosio, Effect of surface fluorination of TiO2 particles on photocatalitytic activity of a hybrid multilayer coating obtained by sol-gel method. ACS Appl. Mater. Interface 4, 150–157 (2012)
B.S. Kim, S.J. Chang, M.K. Ji et al., Ex situ catalytic upgrading of lignocellulosic biomass components over vanadium contained H-MCM-41 catalysts. Catal. Today 265, 184–191 (2016)
Y. Lei, Z. Han, D. Ren, P. Hai, M. Xu, X. Liu, Design of h-BN-filled cyanate/epoxy thermal conductive composite with stable dielectric properties. Macromol. Res. 26, 1–7 (2018)
W. Ling, Y. Zhang, X. Zhang, L. Liu, H. Zhang, Synthesis and properties of cured epoxy mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates. Polym. Compos. 39, 1–12 (2017)
K.C. Yung, T. Xu, H.S. Choy, Development of high thermal conductivity via BNNTs/epoxy/organic-Si hybrid composite systems. J. Mater. Sci. Mater. El. 27, 5217–5224 (2016)
Y. Wu, Z. Wang, X. Shen et al., Graphene/boron nitride-polyurethane micro-laminates for exceptional dielectric properties and high energy densities. ACS Appl. Mater. Interface 10, 26641–26652 (2018)
X. Huang, L. Xie, K. Yang et al., Role of interface in highly filled epoxy/BaTiO3 nanocomposites. Part I-correlation between nanoparticle surface chemistry and nanocomposite dielectric property. IEEE Trans. Dielect. El. In. 21, 467–479 (2014)
C.H. Chien, L.T. Hung, L.H. Ching, Facile preparation of a phosphinated bisphenol and its low;water-absorption epoxy resins for halogen-free copper clad laminates. Polym. Degrad. Stab. 98, 102–108 (2013)
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The authors would like to acknowledge the financial supports from National Key R&D Program of China (2018YFC1508704, 2018YFC0408003) and the English language polishing of the revised manuscript by Professor Jacques Guillaume NOUDEM.
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Ge, M., Li, Q., Zhang, J. et al. Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface modified spherical hBN fillers. J Mater Sci: Mater Electron 31, 4214–4223 (2020). https://doi.org/10.1007/s10854-020-02974-y
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DOI: https://doi.org/10.1007/s10854-020-02974-y