Abstract
The study investigated the effect of tensile and compressive strain on the interfacial reaction of SAC305/Cu system. Experimental results indicated that the thickness of Cu6Sn5 layer on non-strained samples slightly decreased after aging for 120 h and increased with prolonged aging time. The applied tensile strain had an enhanced effect on the growth of Cu6Sn5 phase, while the applied compressive strain inhibited the growth of Cu6Sn5 phase. However, the thickness of Cu3Sn layer at SAC305/Cu solder joints increased gradually with increasing aging time, regardless of whether strain was or not applied on the solder joints. Besides, the mean diameter of Cu6Sn5 grain increased in three systems as the aging time was prolonged to 480 h. The morphology of Cu6Sn5 grain on non-strained samples gradually changed from round-shape into polyhedron-shape with increased aging time. The morphology of Cu6Sn5 grain under tensile or compressive strain was polyhedron-shape. The Kirkendall voids appeared within Cu3Sn layer in three systems after aging for 120 h and the amount of voids increased gradually with prolonged aging time. The applied tensile or compressive strain had an enhanced effect on the formation of voids within Cu3Sn layer and the enhanced effect of applied tensile strain was much remarkable than that of other systems.
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C.Y. Lee, W.C. Moon, S.B. Jung, Surface finishes of rolled copper foil for flexible printed circuit board. Mater. Sci. Eng. A 483(1), 723–726 (2008)
J.X. Wang, K.T. Chen, B.Z. Wen et al., Transesterification of soybean oil to biodiesel using cement as a solid base catalyst. J. Taiwan Inst. Chem. Eng. 43(2), 215–219 (2012)
K.Z. Wang, C.M. Chen, Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering. J. Electron. Mater. 34(12), 1543–1549 (2005)
X. Hu, T. Xu, X. Jiang et al., Interfacial reaction and IMCs growth behavior of Sn3.0Ag0.5Cu/Ni solder bump during aging at various temperatures. J. Mater. Sci. 27(5), 4245–4252 (2016)
X. Hu, T. Xu, L.M. Keer et al., Microstructure evolution and shear fracture behavior of aged Sn3.0Ag0.5Cu/Cu solder joints. Mater. Sci. Eng. A 673, 167–177 (2016)
J.X. Wang, H. Nishikawa, Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging. Microelectron. Reliab. 54(8), 1583–1591 (2014)
H. Nishikawa, N. Iwata, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag–Cu solder on a Cu Pad. J. Mater. Process. Technol. 215(215), 6–11 (2015)
F. Wang et al., Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J. Mater. Sci. (2019). https://doi.org/10.1007/s10854-019-00701-w
Burke C, Punch J. A comparison of the creep behaviour of joint-scale SAC105 and SAC305 solder samples under shear conditions. IEEE Trans. Compon. Pack. Manuf. Technol. (2012)
F. Cheng, F. Gao, J. Zhang et al., Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys. J. Mater. Sci. 46(10), 3424–3429 (2011)
X. Hu, T. Xu, L.M. Keer et al., Microstructure evolution and shear fracture behavior of aged Sn3Ag05Cu/Cu solder joints. Mater. Sci. Eng. A 673, 167–177 (2016)
M.N. Bashir, A.S.M.A. Haseeb, Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux. J. Mater. Sci. 29, 3182–3188 (2018)
C.P. Lin, C.M. Chen, C.H. Lin et al., Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate. J. Alloy. Compd. 502(2), 17–19 (2010)
C.P. Lin, C.M. Chen, Y.W. Yen, Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain. J. Alloy. Compd. 591, 297–303 (2014)
W.K. Liao, C.M. Chen, M.T. Lin et al., Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains. Scr. Mater. 65(8), 691–694 (2011)
Y.J. Chen, C.M. Chen, Mitigative tin whisker growth under mechanically applied tensile stress. J. Electron. Mater. 38(3), 415–419 (2009)
X. Zhang, X. Hu, X. Jiang et al., Effect of Ni addition to the Cu substrate on the interfacial reaction and IMC growth with Sn3.0Ag0.5Cu solder. Appl. Phys. A 124(4), 315 (2018)
H. Li, R. An, C. Wang et al., In situ, quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. J. Alloy. Compd. 634, 94–98 (2015)
K.N. Tu, Solder Joint Technology (Springer, New York, 2007), p. 117
W.Q. Peng, E. Monlevade, M.E. Marques, Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu. Microelectron. Reliab. 47, 2161–2168 (2007)
L. Yin, P. Borgesen, On the root cause of Kirkendall voiding in Cu3Sn. J. Mater. Res. 26(03), 455–466 (2011)
C. Yu, Y. Yang, H. Lu, J.M. Chen, Effects of current stressing on formation and evolution of Kirkendall voids at Sn–3.5Ag/Cu interface. J. Electron. Mater. 39, 1309–1314 (2010)
F.Y. Ouyang, C.L. Kao, In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn–3Ag–0.5Cu flip chip solder joints. J. Appl. Phys. 110, 123525 (2011)
Y.W. Wang, Y.W. Lin, C.R. Kao, Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders. J. Alloy. Compd. 493(1–2), 233–239 (2010)
J.Y. Song, J. Yu, T.Y. Lee, Effects of reactive diffusion on stress evolution in Cu–Sn films. Scr. Mater. 51(2), 167–170 (2004)
R. Olender, A. Nitzan, Lattice theory of solvation and dissociation in macromolecular fluids II. Quasichemical approximation. J. Chem. Phys. 101(3), 2338–2349 (1994)
C. Herring, Effect of change of scale on sintering phenomena. J. Appl. Phys. 21(4), 301–303 (1950)
J. Shen, M. Zhao, H.E. Peipei et al., Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging. J. Alloy. Compd. 574(10), 451–458 (2013)
N. Bao, X. Hu, Y. Li et al., Effects of thermal aging on growth behavior of interfacial intermetallic compound of dip soldered Sn/Cu joints. J. Mater. Sci. 29(10), 8863–8875 (2018)
Y. Lai, X. Hu, Y. Li et al., Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints. J. Mater. Sci.-Mater. Electron. 29, 1–11 (2018)
X. Hu, T. Xu, X. Jiang et al., Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate. Appl. Phys. A 122(4), 278 (2016)
H.K. Kim, K.N. Tu, Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53(23), 16027–16034 (1996)
Acknowledgements
This work was supported by the National Natural Science Foundation of China (Grant No. 51765040), Natural Science Foundation of Jiangxi Province (Grant No. 20161BAB206122) and Postgraduate Innovation special founds of Jiangxi Province (Grant No. YC2018-S060).
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Zhang, X., Hu, X., Jiang, X. et al. Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain. J Mater Sci: Mater Electron 30, 9410–9420 (2019). https://doi.org/10.1007/s10854-019-01271-7
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DOI: https://doi.org/10.1007/s10854-019-01271-7