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Interfacial reaction between liquid-state Sn-xBi solder and Co substrate

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Abstract

The interfacial reaction between liquid-state Sn-xBi (x = 0, 1, 5 and 10 wt%) solders and Co substrate at 260 °C for different soldering duration time was explored to investigate the effect of Bi addition and soldering time on the growth of intermetallic compound (IMC) and grains evolution by scanning electronic microscopy in this study. The results of research indicated that the Bi addition into Sn solder had not changed the formation of interfacial IMC and the single CoSn3 IMC layer formed at Sn-xBi/Co (x = 0, 1, 5 and 10 wt%) joints. The addition of 1 wt% Bi into Sn solder suppressed the growth of interfacial CoSn3 IMC, compared to Sn/Co system. Bi segregation occurred in Sn-10Bi/Co couple due to the supersaturated Bi element and would weaken the inhibiting effect on growth of IMC resulted from more Sn and Co atoms activated. The thickness of IMC at the interface of Sn-5Bi/Co at the minimum number was resulted from Bi solid solution strengthening, Bi segregation attributed to Bi supersaturation and gravity subsequently appeared and gradually influenced the IMC growth when the soldering time increased from 20 to 60 min. Accordingly, the law of IMC growth did not meet the linear relationship between the thickness of IMC and soldering time. Additionally, the thickness of interfacial IMC increased with extending soldering time, regardless of Bi content in Sn solder. Prism-like CoSn3 grain formed at Sn-xBi/Co (x = 0, 1, 5 and 10 wt%) joints and the law of grain mean size was in well agreement with the change of thickness of IMC in cross-sectional images.

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References

  1. Y.W. Wang, Y.W. Lin, C.T. Tu, C.R. Kao, Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu. J. Alloy. Compd. 478, 121–127 (2009)

    Article  Google Scholar 

  2. X.W. Hu, Y.L. Li, L. Liu, Z.X. Min, Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification. J. Alloy. Compd. 625, 241–250 (2015)

    Article  Google Scholar 

  3. C.E. Ho, R.Y. Tsai, Y.L. Lin, C.R. Kao, Effect of Cu concentration on the reactions between Sn–Ag–Cu solders and Ni. J. Electron. Mater. 31, 584–590 (2002)

    Article  Google Scholar 

  4. X.W. Hu, T. Xu, L.M. Keer, Y.L. Li, Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates. J. Ally. Compd. 690, 720–729 (2017)

    Article  Google Scholar 

  5. W.M. Chen, S.K. Kang, C.R. Kao, Effects of Ti addition to Sn–Ag and Sn–Cu solders. J. Alloy. Compd. 520, 244–249 (2012)

    Article  Google Scholar 

  6. P. Sebo, P. Svec. D. Janickovic, E. Lllekova, The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints. Mater. Sci. Eng. A 571, 184–192 (2013)

    Article  Google Scholar 

  7. J. Shen, Y.Y. Pu, H.G. Yin, D.J. Luo, Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys. J. Alloy. Compd. 614, 63–70 (2014)

    Article  Google Scholar 

  8. T.M. Luan, W.B. Guo, S.H. Yang, Z.P. Ma, Effect of intermetallic compounds on mechanical properties of copper joints ultrasonic-soldered with Sn–Zn alloy. J. Mater. Process. Tech. 248, 123–129 (2017)

    Article  Google Scholar 

  9. O. Mokhtari, H. Nishikawa, Correlation between microstructure and mechanical properties of Sn–Bi–X solders. Mater. Sci. Eng. A 651, 831–839 (2016)

    Article  Google Scholar 

  10. P. He, J.H. Zhang, R.L. Zhou, X.Q. Li, Diffusion bonding technology of a titanium alloy to a stainless steel web with an Ni interlayer. Mater. Charact. 43, 289–292 (1999)

    Article  Google Scholar 

  11. H. Ke, Y. Gao, C.R. Kao, Y. Wang, Pattern formation during interfacial reaction in-between liquid Sn and Cu substrate: a simulation study. Acta. Mater. 113, 245–258 (2016)

    Article  Google Scholar 

  12. T.L. Yang, J.J. Yu, W.L. Shih, C.H. Hsueh, C.R. Kao, Effects of silver addition on Cu–Sn microjoints for chip-stacking applications. J. Alloy. Compd. 605, 193–198 (2014)

    Article  Google Scholar 

  13. C.R. Kao, Microstructures developed in solid-liquid reactions: using Cu–Sn raction, Ni–Bi reaction, and Cu–In reaction as examples. Mater. Sci. Eng. A 238, 196–201 (1997)

    Article  Google Scholar 

  14. N.D. Lu, D.H. Yang, L.L. Li, Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures. Acta. Mater. 61, 4581–4590 (2013)

    Article  Google Scholar 

  15. H. Chen, Y.L. Tsai, Y.T. Chang, A.T. Wu, Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes. J. Alloy. Compd. 671, 100–108 (2016)

    Article  Google Scholar 

  16. Z.L. Ma, C.M. Gourlay, Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates. J. Alloy. Compd. 706, 596–608 (2017)

    Article  Google Scholar 

  17. C.H. Wang, S.E. Huang, K.T. Li, Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition. Intermetallics 56, 68–74 (2015)

    Article  Google Scholar 

  18. Z.M. Lai, X.D. Kong, Q.R. You, X.B. Cao, Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint. Microelectron. Reliab. 68, 69–76 (2017)

    Article  Google Scholar 

  19. C.H. Wang, C.Y. Kuo, S.E. Huang, P.Y. Li, Temperature effects on liquid-state Sn/Co interfacial reactions. Intermetallics. 32, 57–63 (2013)

    Article  Google Scholar 

  20. T. Xu, X.W. Hu, Y.L. Li, X.X. Jiang, The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions. J. Mater. Sci. Mater. Electron. 25, 1–14 (2017)

    Google Scholar 

  21. C.H. Wang, C.Y. Kuo, Peltier effect on CoSn3 growth in Sn/Co/Sn couples with different substrate lengths. Mater. Chem. Phy. 153, 72–77 (2015)

    Article  Google Scholar 

  22. G.P. Vassilev, K.I. Lilova, J.C. Gachon, Calorimetric and phase diagram studies of the Co–Sn system. Intermetallics 15, 1156–1162 (2007)

    Article  Google Scholar 

  23. W.J. Zhu, J. Wang, H.S. Liu, Z.P. Jin, The interfacial reaction between Sn–Ag alloys and Co substrate. Mater. Sci. Eng. A 456, 109–113 (2007)

    Article  Google Scholar 

  24. T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao, Low temperature bonding for high temperature applications by using Sn–Bi solders. J. Alloy. Compd. 647, 681–685 (2015)

    Article  Google Scholar 

  25. C.Y. Liu, M.H. Hon, M.C. Wang, Y.R. Chen, Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys. J. Alloy.Compd. 582, 229–235 (2014)

    Article  Google Scholar 

  26. S.W. Yoon, J.R. Soh, H.M. Lee, B.J. Lee, Thermodynamics-aided alloy design and evaluation of Pb-free solder, Sn–Bi–In–Zn system. Acta. Mater. 45, 951–960 (1997)

    Article  Google Scholar 

  27. L. Qi, J. Zhao, X.M. Wang, L. Wang, International Conference on the Business of Electronic Product Reliability and Liability (University of Hong Kong, Hong Kong, 2004), pp. 42–46

    Google Scholar 

  28. X.W. Hu, Y.L. Li, K. Li, Z.X. Min, Effect of Bi segregation on the asymmetrical growth of Cu–Sn intermetallic compounds in Cu/Sn-58Bi/Cu sandwich solder. J. Electron. Mater. 42, 3567–3572 (2013)

    Article  Google Scholar 

  29. G.Y. Li, X.Q. Shi, Effects of bismuth on growth of intermetallic compounds in Sn–Ag–Cu Pb-free solder joints. Trans. Nonferrous Met. Soc. China 16, 739–743 (2006)

    Article  Google Scholar 

  30. D. Witkin, Creep behavior of Bi-containing lead-free solder alloys. J. Electron. Mater. 41, 190–203 (2012)

    Article  Google Scholar 

  31. J.S. Ha, C.S. Kang, J.Y. Park, J.P. Jung, Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate. J. Electron. Mater. 29, 1207–1213 (2000)

    Article  Google Scholar 

  32. H.K. Kim, H.K. Liou, K.N. Tu, Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu. Apply. Phys. Lett. 66, 2337–2339 (1995)

    Article  Google Scholar 

  33. C.H. Wang, C.Y. Kuo, Growth kinetics of the solid-state interfacial reactions in the Sn–Cu/Co and Sn/Co–Cu couples. Mater. Chem. Phys. 130, 651–656 (2011)

    Article  Google Scholar 

  34. O.M. Abdelhadi, L. Ladani, IMC growth of Sn-3.5Ag/Cu system: combined chemical reaction and diffusion mechanisms. J. Alloy. Compds. 537, 87–99 (2012)

    Article  Google Scholar 

  35. C.H. Wang, C.Y. Kuo, Interfacial reactions between eutectic Sn–Pb solder. J. Mater. Sci. 46, 2654–2661 (2011)

    Article  Google Scholar 

  36. M. He, V.L. Acoff, Effect of Bi on the interfacial reaction between Sn-3.7Ag-xBi solders and Cu. J. Electron. Mater. 37, 288–298 (2008)

    Article  Google Scholar 

  37. S.A. Belyakov, J.W. Xian, K. Sweatman, T. Nishimura, Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints. J. Alloy. Compd. 701, 321–334 (2017)

    Article  Google Scholar 

  38. E. Hodulova, M. Palcut, E. Lechovic, B. Simekova, Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X = Bi, In) solders with Cu substrate. J. Alloy. Compd. 509, 7052–7059 (2011)

    Article  Google Scholar 

  39. M. He, V.L. Acoff, Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys. J. Electron. Mater. 35, 2098–2106 (2006)

    Article  Google Scholar 

  40. T.Y. Kang, Y.Y. Xiu, C.Z. Liu, L. Hui, Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect. J. Alloy. Compd. 509, 1785–1789 (2011)

    Article  Google Scholar 

  41. J.W. Xian, S.A. Belyakov, M. Ollivier, K. Nogita, Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. J. Alloy. Compd. 126, 540–551 (2017)

    Google Scholar 

Download references

Acknowledgements

This work was supported by the Nature Science Foundation of China (Nos. 51465039, 51665038, 51765040), Nature Science Foundation of Jiangxi Province (20151BAB206041, 20161BAB206122). Postgraduate Innovation special founds of Jiangxi province (YC2016-S045).

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  1. Key Lab for Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang, 330031, China

    Yu Qiu, Xiaowu Hu, Yulong Li & Xiongxin Jiang

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  1. Yu Qiu
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Correspondence to Xiaowu Hu.

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Qiu, Y., Hu, X., Li, Y. et al. Interfacial reaction between liquid-state Sn-xBi solder and Co substrate. J Mater Sci: Mater Electron 29, 9155–9165 (2018). https://doi.org/10.1007/s10854-018-8943-1

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