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The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

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Abstract

The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was investigated with and without current stressing. The high volume of PdSn4 was formed in the as produced micro-bump joint. Electric current stressing caused the growth of and the conversion between PdSn4 and Ni3Sn4. The conversion of PdSn4 to Ni3Sn4 was accompanied by voids formation between the neighboring intermetallic compounds. The void formation was attributed to the volume difference between the two compounds.

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Acknowledgments

One of the authors, Kwang-Lung Lin, appreciate the Ministry of Science and Technology of the Republic of China (Taiwan) for partial support of this study under NSC 101-2221-E-006-117-MY3.

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Authors and Affiliations

  1. Central Product Solutions, Advanced Semiconductor Engineering, Inc., Kaohsiung, 801, Taiwan, ROC

    Yu-Hsiang Hsiao

  2. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 701, Taiwan, ROC

    Kwang-Lung Lin

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  1. Yu-Hsiang Hsiao
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  2. Kwang-Lung Lin
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Correspondence to Kwang-Lung Lin.

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Hsiao, YH., Lin, KL. The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing. J Mater Sci: Mater Electron 27, 2201–2205 (2016). https://doi.org/10.1007/s10854-015-4011-2

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  • DOI: https://doi.org/10.1007/s10854-015-4011-2

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