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Wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder with Sn, SnBi and Au/Ni coatings

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Abstract

The wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder were investigated. The results indicated that Sn–9Zn–0.5Nd–0.08Nd solder has shown good wettability using water soluble flux and self made flux based on wetting balance testing, and solder with SnBi coating has shown superiority wettability among all three coatings. Moreover, no whisker was observed in Sn–9Zn–0.5Ga–0.08Nd solder with different coatings. But in Sn–9Zn–0.5Ga–1Nd solder, fewer whiskers were observed in solder with SnBi coating compared with Sn and Au/Ni coatings, which can be attributed to the refinement effect of Bi.

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Acknowledgments

This work was supported by Funding of Jiangsu Innovation Program for Graduate Education (the Fundamental Research Funds for the Central Universities, Project No. CXZZ12_0148).

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Authors and Affiliations

  1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Peng Xue, Song-bai Xue & Yi-fu Shen

  2. School of Material Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Fei Long

  3. The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing, 210013, China

    Hong Zhu

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  1. Peng Xue
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  2. Song-bai Xue
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  3. Yi-fu Shen
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Correspondence to Song-bai Xue.

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Xue, P., Xue, Sb., Shen, Yf. et al. Wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd solder with Sn, SnBi and Au/Ni coatings. J Mater Sci: Mater Electron 25, 3520–3525 (2014). https://doi.org/10.1007/s10854-014-2049-1

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  • DOI: https://doi.org/10.1007/s10854-014-2049-1

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