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Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper

  • Metals & corrosion
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Abstract

The φ16 mm single-crystal copper rod billet was prepared by the heated mold horizontal continuous casting process. After cold drawing + 600 °C× 5 s annealing to φ1 mm, the annealed φ1 mm single-crystal copper processing wire was cold drawn to φ0.2 mm (φ1 mm → φ0.2 mm), and the electrical conductivity, tensile strength and microstructure evolution of single-crystal copper wire were compared and analyzed. The research shows that the conductivity of the as-cast single-crystal copper rod is 102.1% IACS, the tensile strength is 141 MPa, the conductivity is as high as 97.26% IACS, after cold drawing to φ0.2 mm, and the tensile strength is greatly increased to 506 MPa. Compared with the as-cast properties, the electrical conductivity of the as-drawn wire is only reduced by 4.7%, while the tensile strength is increased by 258.9%. The as-cast rod exhibits typical characteristics of single-crystal copper; with the increasing amount of deformation, the microstructure evolves in the following form: dislocations generated by slip entanglement into dislocation cells → microstrip structure → layered structure → twin structure. A prediction model for the strength and electrical conductivity of single-crystal copper wire was constructed. The results show that grain refinement strengthening and dislocation strengthening are the key factors affecting the strength and conductivity of single-crystal copper wire, when deformed to φ0.2 mm, and twinning strengthening is superimposed in the above strengthening mechanism.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Acknowledgements

Thanks to Dr. Qianqian Zhu, Dr. Xiaowen Peng, Dr. Yunxiao Hua, etc. for their help in data processing, and thanks to the Electron Microscopy Center of Henan University of Science and Technology for their technical support.

Funding

This work was supported by the National Natural Science Foundation of China (U21A2051, 52173297, 52071133), R & D Projects of Henan Academy of Sciences (220910009), Key R&D and Promotion Projects of Henan Province (212102210441) and Zhongyuan scholar workstation funded project (214400510028).

Author information

Authors and Affiliations

  1. School of Material Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Xin Li, Yanjun Zhou, Yahui Liu, Shaolin Li, Kexing Song, Pengfei Zhang, Hanjiang Wu, Jihua Gu & Siyu He

  2. Provincial and Ministerial Co-Construction Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology, Luoyang, 471023, China

    Yanjun Zhou & Shaolin Li

  3. Henan Academy of Sciences, Zhengzhou, 450002, China

    Kexing Song & Yan Gao

  4. Henan Senger Materials Technology Co., Ltd, Jiaozuo, 454010, China

    Cunli Feng

  5. Chongqing Materials Research Institute Co., Ltd, Chongqing, 400700, China

    Baoan Wu

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  1. Xin Li
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Contributions

XL was responsible for methodology, formal analysis, writing the original draft and visualization. YZ was involved in writing, reviewing and editing, project administration, supervision and funding acquisition. YL took part in conceptualization, writing, reviewing and editing, visualization and data curation. SL contributed to writing, reviewing and funding acquisition. KS participated in writing, reviewing and editing, and funding acquisition. CF was involved in investigation and resources. BW was responsible for resources. PZ carried out investigation and visualization. HW and JG contributed to software. SH and YG took part in visualization.

Corresponding authors

Correspondence to Yanjun Zhou, Yahui Liu or Kexing Song.

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Handling Editor: Naiqin Zhao.

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Li, X., Zhou, Y., Liu, Y. et al. Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper. J Mater Sci 57, 20895–20908 (2022). https://doi.org/10.1007/s10853-022-07919-w

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