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Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration

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Abstract

The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward.

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Data Availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

References

  1. Changzhong J, Pengbo W, Shiheng Z (2016) SLAM fatigue analysis of the vehicle door using ECS. Femfat. Proceedings SAE-China Congress & Exhibition

  2. Doranga S et al (2023) A time frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis using global local modeling technique. J Electron Packag 145(3):031007. https://doi.org/10.1115/1.4056886

    Article  Google Scholar 

  3. Haiting Z, Guangye C (2003) Design of specification for accelerating test of electronic parts of vehicle. J Vib Shock 22(1):61–63

    Google Scholar 

  4. Han JG, Park NC, Hong WS (2009) CAF characteristics of FR-4 printed circuit board (PCB) for automotive electronics. SAE Int

  5. Jacob P (2015) Failure analysis and reliability on system level. Microelectron Reliab 55:2154–2158

    Article  Google Scholar 

  6. Jacob P (2016) Early life field failures in modern automotive electronics – an overview; root causes and precautions. Microelectron Reliab 64:79–83

    Article  Google Scholar 

  7. Khaldarov V et al (2022) Solder Joint Fatigue Studies Subjected to Board-level Random Vibration for Automotive Applications. Proceedings 2022 IEEE 72nd Electronic Components and Technology Conference

  8. Khaldarov V et al (2023) New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference

  9. Kuczynska M et al (2017) The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. Microelectron Reliab 74:155–164

    Article  Google Scholar 

  10. Kumar SM (2008) Analyzing random vibration fatigue. ANSYS Advant 2(3):39–42

    Google Scholar 

  11. Liu S et al (2023) Evaluation of aircraft random vibration under roughness excitation during taxiing. Int J Transp Sci Technol. https://doi.org/10.1016/j.ijtst.2023.07.003

    Article  Google Scholar 

  12. Lu H et al (2023) Random vibration fatigue behavior of directionally solidified superalloy: experiments and evaluation of life prediction methods. Int J Fatigue 175:107746. https://doi.org/10.1016/j.ijfatigue.2023.107746

    Article  Google Scholar 

  13. Shao-tang H et al (2012) Environmental suitability and durability validation of automotive electronic and electric components. Environ Technol 28–32

  14. Smith DJ (2017) Reliability, maintainability and risk: practical methods for engineers. Elsevier Ltd, Kidlington, United Kingdom

    Google Scholar 

  15. Steinberg DS (2000) Vibration analysis for Electronic Equipment. Wiley

  16. Tian K, Chunli L, Huabing J (2015) Adjustment method for random vibration test conditions in simulations of road transportation. Spacecraft Environ Eng

  17. White KJ (1985) The road simulator–a practical laboratory approach. Proc Inst Mech Engrs

  18. Wu M-L (2012) Assessing the impact of uncertainty in Physics-of-Failure analysis of microelectronics damage. Mater Sci Eng A 558:259–264

    Article  Google Scholar 

  19. Xie D et al (2023) A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test. Proceedings 2023 IEEE 73rd Electronic Components and Technology Conference

Download references

Funding

This work was supported by the Project of Scientific Research Foundation of Chongqing Technology and Business University [Grant No.2353002].

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Authors and Affiliations

  1. School of Mechanical Engineering, Chongqing Technology And Business University, No. 19 Xuefu Avenue, Nan’an District, 400067, Chongqing, P.R. China

    Huang Linsen

  2. Zonsen Industrial Group Co., Ltd, 126 Yunan Avenue, Banan District, 400054, Chongqing, P.R. China

    Huang Linsen

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  1. Huang Linsen
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Correspondence to Huang Linsen.

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Linsen, H. Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration. J Electron Test 40, 101–106 (2024). https://doi.org/10.1007/s10836-024-06099-6

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  • DOI: https://doi.org/10.1007/s10836-024-06099-6

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