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Temperature and Humidity Controlled Test Bench for Temperature Sensor Characterization

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Abstract

A temperature and humidity-controlled test bench for a wirelessly-powered ultra-low-power temperature sensor IC is presented. It consists of a closed metallic structure of 0.02 m3, forming a faraday-cage around the design under test (DUT), thermally insulated using Polyethylene foam, to provide electromagnetic interference (EMI) clean and thermally stable test environment with an operating temperature range of -10 °C to 100 °C. The temperature control with a settling accuracy of ± 0.6 °C is achieved with air-cooled 100 W Peltier modules, having fast dynamics to reach 95% of the required temperature within 15 min. The humidity is controlled by air circulation through a desiccant pocket, managed at around 15% to avoid water droplets during defrosting. A controllable vacuum of ~ 1.3 kPa is achieved through a vacuum pump when < 15% of de-humification is needed. The system operates at a lower power consumption of 30 W during the temperature retention phase, with acoustic noise of 58 dB-SPL achieved.

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Acknowledgements

The authors would like to show appreciation towards EDCAS Research Group for supporting the ASIC and its test setup manufacturing; and the Karachi Institute of Economics and Technology (KIET) for providing research facilities.

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Correspondence to Syed Usman Amin, Muhammad Aaquib Shahbaz or Syed Arsalan Jawed.

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The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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Amin, S.U., Shahbaz, M.A., Jawed, S.A. et al. Temperature and Humidity Controlled Test Bench for Temperature Sensor Characterization. J Electron Test 38, 453–461 (2022). https://doi.org/10.1007/s10836-022-06013-y

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  • DOI: https://doi.org/10.1007/s10836-022-06013-y

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