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A novel approach for noise tolerant energy efficient TSPC dynamic circuit design

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Abstract

A dynamic circuit design technique on the basis of true single phase logic is presented in this paper to minimize leakage power consumption. The circuit is comprehensively designed by incorporating a pair of diode transistor and a pair of stacked transistors. Active mode as well as idle mode power consumption and delay is analysed at low and high die temperature. 89–17% saving in power delay product is obtained for the same along with higher unity noise gain and reduced voltage bouncing noise. The analysis of the circuit also includes the investigation of voltage variation effect, process corner analysis and sizing effect analysis. The proposed technique is compared with several previously proposed dynamic circuit design techniques and it is found to have best power delay product. Further, it is implemented on 32 output decoder for enduring the technique. Comprehensive simulation using 90 nm technology in cadence specter, shows that the proposed design vanquish conventional and other previously proposed dynamic circuit design techniques in terms of power, delay, noise and robust against parameter and process corner variations.

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Authors and Affiliations

  1. Department of Electronics and Communication Engineering, National Institute of Technology, Delhi, 110040, India

    Preeti Verma & Alok Kumar Mishra

  2. I K G Punjab Technical University, Kapurthala, Jalandhar, Punjab, 144603, India

    Ajay K. Sharma

  3. School of Electronics, Centre for Development of Advanced Computing, Noida, India

    Arti Noor

  4. Department of Applied Science, National Institute of Technology, Delhi, 110040, India

    Vinay S. Pandey

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  1. Preeti Verma
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  2. Ajay K. Sharma
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  3. Arti Noor
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  4. Alok Kumar Mishra
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  5. Vinay S. Pandey
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Correspondence to Preeti Verma.

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Verma, P., Sharma, A.K., Noor, A. et al. A novel approach for noise tolerant energy efficient TSPC dynamic circuit design. Analog Integr Circ Sig Process 100, 119–131 (2019). https://doi.org/10.1007/s10470-019-01444-8

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