Abstract
In this manuscript, thermal annealing effects on platinum (Pt) thin film on various substrate configurations have been studied experimentally. The objective of this study is to attain a thermally stable ‘Pt’ film that can sustain annealing temperatures > 500 °C for gas sensing applications. 200 nm thick ‘Pt’ was evaporated using Electron Beam (E-Beam) Evaporation System on silicon substrate. High temperature (> 450 °C) degradation of platinum films with different adhesion layers of titanium and its oxide was examined on silicon substrate. Impact of annealing at two different peak temperatures viz. 450 °C and 520 °C on platinum film was studied in terms of ‘Pt’ film morphological changes and electrical resistance variations. A novel method of making platinum micro-heater on titanium oxide film (prepared using rapid thermal anneal process) is described, which results into stable platinum film at annealing temperatures up to 520 °C.
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Acknowledgements
Authors would like to thank Sh. Surinder Singh (Director, SCL) for his continuous motivation to carry out this work. We also thank MEMS Fabrication Division (MFD) team for carrying out the fabrication of micro-heater. We also want to thank SCL’s VLSI Test Division (VTD), VLSI Packaging Division (VPD) and Sh. Rohit Ranjan (PTDD) for providing the testing, annealing and SEM services without which this study could not be accomplished successfully.
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Chauhan, A.K., Tiwari, S., Singh, S. et al. Experimental study of thermal annealing effects on evaporated platinum thin film with various substrate configurations. Microsyst Technol 29, 107–114 (2023). https://doi.org/10.1007/s00542-022-05394-6
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DOI: https://doi.org/10.1007/s00542-022-05394-6