Skip to main content
Log in

Reliable before-fabrication forecasting of MEMS piezoresistive pressure sensor: mathematical modelling and numerical simulation

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

Micro-mechanical systems (MEMS) based piezoresistive pressure sensors have significant importance in several pressure sensor devices in real world, i.e., aviation, IoT and consumer electronics, nuclear and thermal power plants. Mathematical analysis for modelling piezoresistive pressure sensors is gaining significant importance. MEMS piezoresistive pressure sensors utilize diaphragms of several shapes and geometries. In this work, a MEMS piezoresistive pressure sensor having a square diaphragm and piezoresistive elements attached in a Wheatstone bridge configuration useful in harsh environmental conditions has been thoroughly analyzed and presented. Silicon carbide (SiC) has higher Young’s Modulus, carrier mobility, corrosion tolerance, Poisson’s ratio, poses extreme chemical inertness and is extremely wear resistant—properties which are absolutely essential for application in harsh environments. Hence, Silicon carbide is most preferred for fabricating these sensors. Sensitivity is a crucial parameter that defines the sensor’s performance. According to thin plate mechanics, thinner the diaphragm membrane, more it has deflection, stress and sensitivity, but it deteriorates the linearity of the sensor which happens to be a crucial parameter. Thus, optimal structural parameters need to be chosen to improve the sensitivity of the pressure sensor. Different device characteristics of these sensors have been measured, analyzed and compared to get the best performance out of them. The simulation of this piezoresistive pressure sensor is carried out in MATLAB. The authors have presented a detailed mathematical model in this work which assists in assessing the affectability of piezoresistive SiC-based pressure sensors analytically and their working in harsh environmental conditions prior to going for the fabrication process.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  • Belwanshi V (2021) Analytical modeling to estimate the sensitivity of MEMS technology-based piezoresistive pressure sensor. J Comput Electron 20:668–680. https://doi.org/10.1007/s10825-020-01592-5

    Article  Google Scholar 

  • Belwanshi V, Topkar A (2019) Quantitative analysis of MEMS piezoresistive pressure sensors based on wide band gap materials. IETE J Res 1:1–11

    Google Scholar 

  • Bhutani S, Yadav M, Dhariwal S, Singh Dr. Kulwant & Alvi, Dr. Parvez. (2019). Stress and frequency analysis of silicon diaphragm of MEMS based piezoresistive pressure sensor.International Journal of Modern Physics B.33. 1950040. https://doi.org/10.1142/S0217979219500401

  • Bhutani S, Singh K, Alvi P (2020) Influence of the pressure range on temperature coefficient of resistivity (TCR) for polysilicon piezoresistive MEMS pressure sensor. Physica Scripta. 

  • Bhutani S, Yadav M, Singh K, Kumar S, Alvi P (2020) Understanding vibrant behavior of Si-circular diaphragm for low-pressure measurement. International Journal of Modern Physics B 34:2050174. https://doi.org/10.1142/S021797922050174X

    Article  Google Scholar 

  • Deimerly Y (2013) Towards Ultra–Compact Inertial Platforms Based OnPiezoresistive Nanogauges: Focus On Co–Integration Issues, Ph.D:Dissertation, Electronics Université Paris–Est,

  • Donida A, Barrettino D (2015) A low–power interface circuit for piezoresistivetransducers, IEEE International Conference on Instrumentation andMeasurement Technology

  • Dounkal MK, Bhan RK, Kumar N (2020) Effects of various loading on the performance of MEMS cantilever beam for in-field tuning of sensors and actuators for high temperature and harsh environment applications. Microsyst Technol 26:377–394. https://doi.org/10.1007/s00542-019-04551-8

    Article  Google Scholar 

  • Farhath M, Samad MF (2020) Design and simulation of a high sensitive stripped-shaped piezoresistive pressure sensor. J Comput Electron 19:310–320. https://doi.org/10.1007/s10825-019-01429-w

    Article  Google Scholar 

  • Farisi MSA, Hirano H, Tanaka S (June 2020) Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm,. J Microelectromech Syst 29(3):418–426. doi: https://doi.org/10.1109/JMEMS.2020.2984229

  • Jindal SK, Raghuwanshi SK (2015) A complete analytical model for circular diaphragm pressure sensor with freely supported edge. Microsyst Technol 21:1073–1079. https://doi.org/10.1007/s00542-014-2144-5

    Article  Google Scholar 

  • Jindal SK, Magam SP, Shaklya M (2018) Analytical modeling and simulation of MEMS piezoresistive pressure sensors with a square silicon carbide diaphragm as the primary sensing element under diferent loading conditions. J Comput Electron 17(4):1780–1789

    Article  Google Scholar 

  • Kähler J, Stranz A, Doering L et al (2012) Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments. Microsyst Technol 18:869–878. https://doi.org/10.1007/s00542-011-1396-6

    Article  Google Scholar 

  • Kumar SS, Pant BD (2014) Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review. Microsyst Technol 20:1213–1247. https://doi.org/10.1007/s00542-014-2215-7

    Article  Google Scholar 

  • Kumar SS, Pant BD (2015) Polysilicon thin film piezoresistive pressure microsensor: design, fabrication and characterization. Microsyst Technol 21:1949–1958. https://doi.org/10.1007/s00542-014-2318-1

    Article  Google Scholar 

  • Kumar SS, Pant BD (2016) Effect of piezoresistor configuration on output characteristics of piezoresistive pressure sensor: an experimental study. Microsyst Technol 22:709–719. https://doi.org/10.1007/s00542-015-2451-5

    Article  Google Scholar 

  • Li C, Cordovilla F, Jagdheesh R et al (2017) Design and optimization of a novel structural MEMS piezoresistive pressure sensor. Microsyst Technol 23:4531–4541. https://doi.org/10.1007/s00542-016-3187-6

    Article  Google Scholar 

  • Lee C (2001) “Analytical solutions of sensitivity for pressure microsensors,“ in IEEE Sensors Journal, vol. 1, no. 4, pp. 340–344, Dec. doi: https://doi.org/10.1109/7361.983474

  • Love AEH (1944) The Mathematical Theory of Elasticity, vol 4. Dover, New York

    MATH  Google Scholar 

  • Mehmood Z, Haneef I, Udrea F (2020) Material selection for optimum design of MEMS pressure sensors. Microsyst Technol 26:2751–2766. https://doi.org/10.1007/s00542-019-04601-1

    Article  Google Scholar 

  • Nag M, Singh J, Kumar A, Alvi Dr. Parvez & Singh, Dr. Kulwant. (2019). Sensitivity enhancement and temperature compatibility of graphene piezoresistive MEMS pressure sensor.Microsystem Technologies. https://doi.org/10.1007/s00542-019-04392-5

  • Nguyen TK, Phan HP, Dinh T, DowlingKM, Foisal ARM, Senesky DG, Nguyen NT, Dao DV (2018) Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures. Mater Des 156:441–445

    Article  Google Scholar 

  • Phan H, Dao DV, Nakamura K, Dimitrijev S, Nguyen N (2015) “The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review,“ in Journal of Microelectromechanical Systems, vol. 24, no. 6, pp. 1663–1677, Dec. doi: https://doi.org/10.1109/JMEMS.2015.2470132

  • Samridhi M, Sharma K, Singh, Alvi PA (2019) “Comparative study of displacement profile for circular and square silicon diaphragm.“ In American Institute of Physics Conference Series, vol. 2100, no. 2,

  • Tian B, Shang H, Zhao L et al (2021) Performance optimization of SiC piezoresistive pressure sensor through suitable piezoresistor design. Microsyst Technol. https://doi.org/10.1007/s00542-020-05175-z

    Article  Google Scholar 

  • Timoshenko SP, WoinowskyKrieger S (1959) Theory of plates and shells. McGraw-hill, London

    Google Scholar 

  • Verma P, Punetha D, Pandey SK (2020) Sensitivity Optimization of MEMS Based Piezoresistive Pressure Sensor for Harsh Environment. Silicon 12:2663–2671. https://doi.org/10.1007/s12633-019-00362-8

    Article  Google Scholar 

  • Vivek Pandey A, Mandal S, Sisle MP, Gururajan RO, Dusane Piezoresistive pressure sensor using nanocrystalline silicon thin film on flexible substrate, Sensors and Actuators A: Physical, Volume 316, 2020, 112372, ISSN 0924–4247, https://doi.org/10.1016/j.sna.2020.112372

  • Xu H, Zhang H, Deng Z, San H, Yu Y (2013) Fabrication of silicon piezoresistive pressure sensor using a reliable wet etching process. 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 424–427. https://doi.org/10.1109/NEMS.2013.6559763

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Sumit Kumar Jindal.

Additional information

Publisher’s note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Jindal, S.K., Patra, R., Banerjee, S. et al. Reliable before-fabrication forecasting of MEMS piezoresistive pressure sensor: mathematical modelling and numerical simulation. Microsyst Technol 28, 1653–1661 (2022). https://doi.org/10.1007/s00542-022-05305-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-022-05305-9

Navigation