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Study on the effect of heating plate thickness on the micro induction heater for thermal bubbles generation

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Abstract

This paper designed a micro planar induction heater for thermal bubbles generation. The micro heater which consists of a micro planar coil, a copper heating plate and a glass slide was fabricated with MEMS fabrication process. The relations between the heating performance and the thickness of heating plate were studied in the simulation with the software of COMSOL. The experimental system has been built and the experimental tests for thermal bubble generation have been also carried out with the prototype. The process of thermal bubbles generation was recorded by the video camera. The frequency of AC current applied in the experiment is 100 kHz and the heating time of 1 s. The experimental results indicated that the micro heater has the best heating performance with the heating plate thickness of 12–16 μm, and the minimum power for thermal bubbles generation was only 0.427 W. This micro heater can be applied to a variety of thermal bubble devices, such as micro actuator, micro ejector and micro pump.

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Acknowledgments

Project of the National Natural Science Foundation of China No. 51105011 supported this research. This work was supported by the Specialized Research Fund for the Doctoral Program of Higher Education (No. 20101103120002). China Scholarship Council supported this research.

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Authors and Affiliations

  1. College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

    Bendong Liu, Yuepeng Hou, Jianchuang Sun & Jiahui Yang

  2. Beijing Vocational College of Agriculture, Beijing, 102208, China

    Jiahui Yang

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  1. Bendong Liu
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  2. Yuepeng Hou
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  3. Jianchuang Sun
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  4. Jiahui Yang
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Correspondence to Yuepeng Hou.

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Liu, B., Hou, Y., Sun, J. et al. Study on the effect of heating plate thickness on the micro induction heater for thermal bubbles generation. Microsyst Technol 22, 1005–1011 (2016). https://doi.org/10.1007/s00542-015-2466-y

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  • DOI: https://doi.org/10.1007/s00542-015-2466-y

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