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Additive manufacturing of Cu/Ni by selective electrochemical deposition on local conductive substrate

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Abstract

Electrodeposition is a novel and benign fabrication method which excellently combines electrochemical deposition mechanism and additive manufacturing to realize the processing of metal-based structures layer-upon-layer. Herein, an unusual additive manufacturing (AM) method is proposed based on electrochemical deposition. Notably, three-dimensional forming of metal by local conductive samples (PLA-CNTs7wt%) as cathode through selective electrochemical deposition was realized. Moreover, the effect of the deposition time on the surface morphology and quality of the sample were explored. Besides, the method of preparing metal parts in array type solves the problem of slow electrochemical additive manufacturing (ECAM) and provides a new approach to achieve mass production for industry. Then, the prepared copper-nickel multilayer metal samples realized the ECAM of multi-metals. Finally, the 4D printing effect of copper-nickel bimetallic samples was preliminarily explored, and the feasibility of preparing energy storage elements by selective electrochemical deposition was further proved.

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Funding

This research was supported by National Natural Science Foundation of China (No.52075219) and National Key R&D Program of China (No. 2022YFB4600202).

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Authors and Affiliations

  1. School of Mechanical and Aerospace Engineering, Jilin University, Changchun, 130025, Jilin, China

    Chenghan Zhao, Jing Wang, Tianyu Liu, Jinyu Guo & Wenzheng Wu

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  1. Chenghan Zhao
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  2. Jing Wang
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  3. Tianyu Liu
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  4. Jinyu Guo
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  5. Wenzheng Wu
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Contributions

Chenghan Zhao and Jing Wang played guiding roles in this paper and contributed equally to the article as co-first authors. Wenzheng Wu contributed to the conceptualization, methodology, and resources. Tianyu Liu and Jinyu Guo contributed to experimental investigation and prepared the original draft. Chenghan Zhao and Jing Wang contributed to the data curation, validation, reviewing and editing. All authors have read and agreed to the published version of the manuscript.

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Correspondence to Wenzheng Wu.

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Chenghan Zhao and Jing Wang as co-first authors.

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Zhao, C., Wang, J., Liu, T. et al. Additive manufacturing of Cu/Ni by selective electrochemical deposition on local conductive substrate. Int J Adv Manuf Technol 126, 5081–5087 (2023). https://doi.org/10.1007/s00170-023-11426-w

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  • DOI: https://doi.org/10.1007/s00170-023-11426-w

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