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Surface integrity of ultrasonic-assisted dry milling of SLM Ti6Al4V using polycrystalline diamond tool

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Abstract

Surface roughness of conventional (CL) Ti6Al4V and selective laser melting (SLM) Ti6Al4V was investigated and contrasted using the method of conventional milling (CM) and ultrasonic-assisted milling (UAM) in this paper. Compared with the CL Ti6Al4V, results indicated that surface roughness of the SLM Ti6Al4V using the CM and UAM can be reduced by up to 37.5% and 18.3%, respectively. The surface roughness of SLM Ti6Al4V and CL Ti6Al4V using the UAM compared with that of CM can be reduced up to 23.3% and 19.1%, respectively. It was found that SEM topography(1500 ×) of the CL Ti6Al4V and the SLM Ti6Al4V has no prominent difference under the condition of CM or UAM. Moreover, it was observed that the SEM topography of the machined SLM Ti6Al4V or CL Ti6Al4V can be effectively improved using the UAM rather than the CM. Finally, the improvement mechanism of surface roughness was discussed and analyzed.

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Funding

This work was supported by the Natural Science Foundation of Anhui Province of China (1808085ME117), Cultivating outstanding talents in colleges and universities(gxgnfx2019013), New material preparation and printing process development based on SLM (2020ybxm03) and Young and middle-aged Top Talent Program of Anhui Polytechnic University.

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Authors and Affiliations

  1. School of Mechanical Engineering, Anhui Polytechnic University, Wuhu, 241000, China

    Yongsheng Su

  2. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics & Astronautics, Nanjing, 210016, China

    Liang Li

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  1. Yongsheng Su
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  2. Liang Li
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Yongsheng Su: ideas, methodology, milling experiments, and writing-original draft. Liang Li: experimental method guidance.

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Correspondence to Yongsheng Su.

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Su, Y., Li, L. Surface integrity of ultrasonic-assisted dry milling of SLM Ti6Al4V using polycrystalline diamond tool. Int J Adv Manuf Technol 119, 5947–5956 (2022). https://doi.org/10.1007/s00170-022-08669-4

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  • DOI: https://doi.org/10.1007/s00170-022-08669-4

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