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Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

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Abstract

Adhesively bonded sandwich structure with dissimilar materials becomes an important means of lightweight for the next generation of autobody closure panels. However, during the baking process, the complicated change of physical properties of the adhesive can lead to structural mismatch deformation. In this paper, a multi-physics coupling numerical model of the curing process is proposed to reveal the deformation mechanism of adhesively bonded sandwich structures quantitatively. The material constitutive model of the one-component hemming adhesive hemming adhesive is established, considering evolution of curing properties. The curing process of typical aluminum alloy and steel-bonded sandwich structure is simulated in COMSOL Multiphysics. The predicted surface deformation of the component is verified by experiment using Digital Image Correlation (DIC) technique, which captures the full-field displacement in a non-intrusive manner. Then, the development process of surface deformation of the outer panel and residual internal stress of the adhesive layer is analyzed, and the influence of temperature cycle on the maximum deformation of the component is discussed. The results show that at the beginning of holding stage, the deformed component slightly rebounds, which is related to the chemical shrinkage. Mechanical strain caused by the coefficient of thermal expansion (CTE) and stiffness difference of the inner and outer panels is dominant in the adhesive layer. Reducing the curing rate and maximum holding temperature can reduce the overall deformation of the structure.

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The raw/processed data are available from the corresponding author on reasonable request.

Code availability

The software application/custom code is available from the corresponding author on reasonable request.

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Funding

This research was supported by the NSFC-China (National Natural Science Foundation of China) Project (No. 51975416 and No. 51275359).

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Authors and Affiliations

  1. School of Mechanical Engineering, Tongji University, Shanghai, China

    Jianjun Li, Wenfeng Zhu, Yuanhui Li & Genglin Tang

Authors
  1. Jianjun Li
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  2. Wenfeng Zhu
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  3. Yuanhui Li
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Contributions

JianJun Li completed the simulation and experiment analysis and wrote the manuscript. WenFeng Zhu was in charge of research method and framework of the whole manuscript. Yuanhui Li and Genglin Tang assisted in literature investigation and experiment. All authors read and approved the final manuscript.

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Correspondence to Wenfeng Zhu.

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Li, J., Zhu, W., Li, Y. et al. Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials. Int J Adv Manuf Technol 120, 1189–1201 (2022). https://doi.org/10.1007/s00170-021-08480-7

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  • DOI: https://doi.org/10.1007/s00170-021-08480-7

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