Skip to main content
SpringerLink
Log in

Investigation of subsurface damage considering the abrasive particle rotation in brittle material grinding

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Brittle materials are prone to brittle fracture which is a primary mechanism of material removal in grinding process. Subsurface damage (SSD) strongly affects the quality of grinding surface which is necessary to be evaluated in brittle material grinding. In this paper, the theoretical analysis of SSD is presented in detail considering the effect of abrasive particle rotation along with the wheel. With the increasing rotation angle of abrasive particle, both the median and lateral cracks incline gradually. Moreover, SSD could disappear below the final grinding surface when the rotation angle of abrasive particle reaches a certain critical value. In addition, the grinding depth, the wheel diameter, and the ratio of wheel speed to workpiece speed influence the rotation angle of an abrasive particle; the effects of these parameters on SSD depth are also studied in detail by theoretical analysis and numerical simulation. The larger wheel diameter and the larger ratio of wheel speed to workpiece speed can obtain a smaller SSD depth, but the effect of grinding depth is unapparent due to the kinematic characteristics of the grinding process. The results are meaningful and helpful in predicting SSD depth and selecting the reasonable grinding parameters to obtain a good surface quality in brittle material grinding.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. De Chiffre L, Kunzmann H, Peggs GN, Lucca DA (2003) Surfaces in precision engineering, microengineering and nanotechnology. CIRP Ann-Manuf Technol 52(2):561–577

    Article  Google Scholar 

  2. Arif M, Rahman M, San WY (2011) Analytical model to determine the critical feed per edge for ductile–brittle transition in milling process of brittle materials. Int J Mach Tools Manuf 51(3):170–181

    Article  Google Scholar 

  3. Camp DW, Kozlowski MR, Sheehan LM, Nichols MA, Dovik M, Raether RG, Thomas IM (1998) Subsurface damage and polishing compound affect the 355-nm laser damage threshold of fused silica surfaces. International Society for Optics and Photonics :356–364

  4. Giovanola JH, Finnie I (1980) On the machining of glass. J Mater Sci 15(10):2508–2514

    Article  Google Scholar 

  5. Bifano TG, Dow TA, Scattergood RO (1991) Ductile-regime grinding: a new technology for machining brittle materials. J Manuf Sci E-T ASME 113(2):184–189

    Google Scholar 

  6. Cai MB, Li XP, Rahman M (2007) Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation. Int J Mach Tools Manuf 47(1):75–80

    Article  Google Scholar 

  7. Liu K, Li XP, Liang SY (2007) The mechanism of ductile chip formation in cutting of brittle materials. Int J Adv Manuf Technol 33(9–10):875–884

    Article  Google Scholar 

  8. Cao JG, Wu YB, Li JY, Zhang QJ (2016) Study on the material removal process in ultrasonic-assisted grinding of SiC ceramics using smooth particle hydrodynamic (SPH) method. Int J Adv Manuf Technol 83(5–8):985–994

    Article  Google Scholar 

  9. Arif M, Xinquan Z, Rahman M, Kumar S (2013) A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials. Int J Mach Tools Manuf 64:114–122

    Article  Google Scholar 

  10. Li BZ, Ni JM, Yang JG, Liang SY (2014) Study on high-speed grinding mechanisms for quality and process efficiency. Int J Adv Manuf Technol 70(5–8):813–819

    Article  Google Scholar 

  11. Bach H, Neuroth N (1998) The properties of optical glass. Springer Science & Business Media

    Book  Google Scholar 

  12. Lawn BR, Fuller ER (1975) Equilibrium penny-like cracks in indentation fracture. J Mater Sci 10(12):2016–2024

    Article  Google Scholar 

  13. Lawn BR, Swain MV (1975) Microfracture beneath point indentations in brittle solids. J Mater Sci 10(1):113–122

    Article  Google Scholar 

  14. Wang CC, Fang QH, Chen JB, Liu YW, Jin T (2015) Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process. Int J Adv Manuf Technol 83(5–8):937–948

    Google Scholar 

  15. Chen JB, Fang QH, Li P (2015) Effect of grinding wheel spindle vibration on surface roughness and subsurface damage in brittle material grinding. Int J Mach Tools Manuf 91:12–23

    Article  Google Scholar 

  16. Lawn BR, Evans AG, Marshall DB (1980) Elastic/plastic indentation damage in ceramics: the median/radial crack system. J Am Ceram Soc 63(9–10):574–581

    Article  Google Scholar 

  17. Marshall DB, Lawn BR, Evans AG (1982) Elastic/plastic indentation damage in ceramics: the lateral crack system. J Am Ceram Soc 65(11):561–566

    Article  Google Scholar 

  18. Turchetta S (2009) Cutting force on a diamond grit in stone machining. Int J Adv Manuf Technol 44(9–10):854–861

    Article  Google Scholar 

  19. Agarwal S, Rao PV (2008) Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding. Int J Mach Tools Manuf 48(6):698–710

    Article  Google Scholar 

  20. Agarwal S, Rao PV (2010) Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide. Int J Mach Tools Manuf 50(12):1077–1087

    Article  Google Scholar 

  21. Feng J, Chen P, Ni J (2013) Prediction of grinding force in microgrinding of ceramic materials by cohesive zone-based finite element method. Int J Adv Manuf Technol 68(5–8):1039–1053

    Article  Google Scholar 

  22. Gu WB, Yao ZQ, Liang XG (2011) Material removal of optical glass BK7 during single and double scratch tests. Wear 270(3):241–246

    Article  Google Scholar 

  23. Gu WB, Yao ZQ (2011) Evaluation of surface cracking in micron and sub-micron scale scratch tests for optical glass BK7. J Mech Sci Technol 25(5):1167–1174

    Article  Google Scholar 

  24. Wang CC, Chen JB, Fang QH, Liu F, Liu YW (2016) Study on brittle material removal in the grinding process utilizing theoretical analysis and numerical simulation. Int J Adv Manuf Technol :1–12

  25. Huang H, Yin L, Zhou LB (2003) High speed grinding of silicon nitride with resin bond diamond wheels. J Mater Process Technol 141(3):329–336

    Article  Google Scholar 

  26. Chen JY, Shen JY, Huang H, Xu XP (2010) Grinding characteristics in high speed grinding of engineering ceramics with brazed diamond wheels. J Mater Process Technol 210(6):899–906

    Article  Google Scholar 

  27. Liu DF, Cong WL, Pei ZJ, Tang YJ (2012) A cutting force model for rotary ultrasonic machining of brittle materials. Int J Mach Tools Manuf 52(1):77–84

    Article  Google Scholar 

  28. Zhang CL, Zhang JF, Feng PF (2013) Mathematical model for cutting force in rotary ultrasonic face milling of brittle materials. Int J Adv Manuf Technol 69(1–4):161–170

    Article  Google Scholar 

  29. Xiao XZ, Zheng K, Liao WH (2014) Theoretical model for cutting force in rotary ultrasonic milling of dental zirconia ceramics. Int J Adv Manuf Technol 75(9–12):1263–1277

    Article  Google Scholar 

  30. Yao ZQ, Gu WB, Li KM (2012) Relationship between surface roughness and subsurface crack depth during grinding of optical glass BK7. J Mater Process Technol 212(4):969–976

    Article  Google Scholar 

  31. Lawn B, Wilshaw R (1975) Indentation fracture: principles and applications. J Mater Sci 10(6):1049–1081

    Article  Google Scholar 

  32. Marinescu ID, Rowe WB, Dimitrov B, Inaski I (2004) Tribology of abrasive machining processes. Elsevier

  33. Malkin S (1989) Grinding technology: theory and applications of machining with abrasives (Ellis Horwood limited. Chichester, England

    Google Scholar 

  34. Cook RF, Pharr GM (1990) Direct observation and analysis of indentation cracking in glasses and ceramics. J Am Ceram Soc 73(4):787–817

    Article  Google Scholar 

  35. Nakamura M, Sumomogi T, Endo T (2003) Evaluation of surface and subsurface cracks on nano-scale machined brittle materials by scanning force microscope and scanning laser microscope. Surf Coat Tech 169:743–747

    Article  Google Scholar 

  36. Gu WB, Yao ZQ, Li K (2011) Evaluation of subsurface crack depth during scratch test for optical glass BK7. P I Mech Eng C-J Mec :0954406211412458

  37. Gu WB, Yao ZQ, Li HL (2011) Investigation of grinding modes in horizontal surface grinding of optical glass BK7. J Mater Process Technol 211(10):1629–1636

    Article  Google Scholar 

  38. Shaw MC (1996) Principles of abrasive processing, vol 13. Oxford University Press

  39. Mayer JE, Fang GP, Kegg RL (1994) Effect of grit depth of cut on strength of ground ceramics. CIRP Ann-Manuf Techn 43(1):309–312

    Article  Google Scholar 

  40. Young HT, Chen DJ (2006) Online dressing of profile grinding wheels. Int J Adv Manuf Technol 27(9–10):883–888

    Article  Google Scholar 

  41. Sahu P, Sagar R (2006) Development of abrasive cut-off wheel having side grooves. Int J Adv Manuf Technol 31(1–2):37–40

    Article  Google Scholar 

  42. Ma Y, Lou ZF (2005) Abrasive technology of single-crystal diamond by diamond abrasive wheel. Key Eng Mater 291:21–26

    Article  Google Scholar 

  43. Jackson MJ, Davis CJ, Hitchiner MP, Mills B (2001) High-speed grinding with CBN grinding wheels—applications and future technology. J Mater Process Technol 110(1):78–88

    Article  Google Scholar 

  44. Hecker RL, Liang SY (2003) Predictive modeling of surface roughness in grinding. Int J Mach Tools Manuf 43(8):755–761

    Article  Google Scholar 

  45. Li K, Liao TW (1996) Surface/subsurface damage and the fracture strength of ground ceramics. J Mater Process Technol 57(3):207–220

    Article  Google Scholar 

  46. Park HW, Liang SY (2008) Force modeling of micro-grinding incorporating crystallographic effects. Int J Mach Tools Manuf 48(15):1658–1667

    Article  Google Scholar 

  47. Zhu DH, Yan SJ, Li BZ (2014) Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness. Comp mater Sci 92:13–21

    Article  Google Scholar 

  48. Inasaki I (1996) Grinding process simulation based on the wheel topography measurement. CIRP Ann-Manuf Technol 45(1):347–350

    Article  Google Scholar 

  49. Chen MJ, Zhao QL, Dong S, Li D (2005) The critical conditions of brittle–ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding. J Mater Process Technol 168(1):75–82

    Article  Google Scholar 

  50. Sun DW, Sealy MP, Liu ZY, Fu CH, Guo YB, Fang FZ, Zhang B (2015) Finite element analysis of machining damage in single-grit grinding of ceramic knee implants. Procedia Manufacturing 1:644–654

    Article  Google Scholar 

  51. Hibbit D, Karlsson B, Sorenson P (2010) Abaqus/explicit user’s manual, version 6.10, Abaqus Inc

  52. Subramanian K, Ramanath S, Tricard M (1997) Mechanisms of material removal in the precision production grinding of ceramics. J Manuf Sci E-T ASME 119(4A):509–519

    Article  Google Scholar 

  53. Lambropoulos JC (2000) From abrasive size to subsurface damage in grinding. Convergence 8:1–3

    Google Scholar 

  54. Zhao B, Gao S, Kang RK, Zhu XL, Guo DM (2016) Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding. Adv Mater Res 1136:497–502

    Article  Google Scholar 

  55. Axinte D, Butler-Smith P, Akgun C, Kolluru K (2013) On the influence of single grit micro-geometry on grinding behavior of ductile and brittle materials. Int J Mach Tools Manuf 74:12–18

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, 410082, People’s Republic of China

    Junkui Quan, Qihong Fang & Youwen Liu

  2. The Faculty of Mechanical Engineering and Mechanics, Ningbo University, Ningbo, 315000, People’s Republic of China

    Jianbin Chen & Chao Xie

  3. School of Engineering and Material Sciences, Queen Mary, University of London, London, E1 4NS, UK

    Pihua Wen

Authors
  1. Junkui Quan
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Qihong Fang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jianbin Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Chao Xie
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Youwen Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Pihua Wen
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Qihong Fang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Quan, J., Fang, Q., Chen, J. et al. Investigation of subsurface damage considering the abrasive particle rotation in brittle material grinding. Int J Adv Manuf Technol 90, 2461–2476 (2017). https://doi.org/10.1007/s00170-016-9567-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-016-9567-3

Keywords

Search

Navigation