Thermal Structure Optimization of a Compact Power Supply Module

Abstract

The thermal structure optimization design of a compact power supply module is investigated by using CFD techniques. The thermal resistance network model is established, and the optimal design of the module heat transfer structure is realized by optimizing its thermal expansion resistance and cold plate convective heat transfer resistance. The analysis results show that, when the area of the metal substrate is constant, the optimal thickness dimension minimizes the total thermal resistance; when the thickness is constant, the total thermal resistance decreases and becomes stable as the substrate area increases. In the process of optimizing the micro-channel structure, based on the engineering practice, the total width of the flow path is fixed, the optimal structural parameter of the micro-channel is obtained under the conditions of constant flow resistance and constant flow rate respectively.