Abstract
Electronic components, such as package substrate, need materials having high thermal conductivity and low expansion at the same time. The effect of semi-solid rheo-diecasting on microstructure, mechanical properties and thermal physical properties of high-silicon content aluminum alloy (Al-20Si-Cu-Fe-Mg) with high thermal conductivity and low thermal expansion, was investigated. The results show that compared with gravity casting, eutectic silicon in alloys made with semi-solid rheo-diecasting was refined, and the microstructure of the alloy was more homogeneous. There were few internal defects in castings and the tensile strength in as-cast cast state was increased to 192.4 MPa. At 25–150 °C range, the average thermal expansion coefficient was 17.05 × 10−6 ℃−1, which decreased by about 3.54%, and the average thermal conductivity was elevated to 146 W/(m · K), which increased about 17.5%.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Tang, T., Zhang, X., Xu, Z.: Research status and trend of electronic packaging materials. J. Nanjing Univ. Technol. (Self-Discipl. Ed.) 32(4), 105–110 (2010)
Kim, D., Lee, J., Kim, J., et al.: Enhancement of heat dissipation of LED module with cupric-oxide composite coating on aluminum-alloy heat sink. Energy Convers. Manag. 106, 958–963 (2015)
Luo, G., Yuan, Z.: Warm extrusion process of 6061 aluminium alloy. Hot Work. Process 41(1), 178–180 (2012)
Wu, S., Wan, L., et al.: Semi-solid die casting technology of high silicon aluminum alloy. Metal Process, pp. 29–32 (2010)
Hahn, T.A., Armstrong, R.W.: Internal stress and solid solubility effects on the thermal expansivity of Al-Si eutectic alloys. Int. J. Thermophys. 9(2), 179–193 (1988)
Yan, Y.W., Geng, L.: Effects of particle size on the thermal expansion behavior of SiCp/Al composites. J. Mater. Sci. 351(15), 6433–6438 (2007)
Wu, Y., Liu, X., et al.: Effect of silicon phase morphology and content on linear expansion coefficient of Al-Si alloy. Chin. J. Nonferrous Met. 17(5), 688–692 (2007)
Kittel, C., Xiang, J., Wu, X.: Introduction to Solid State Physics. Chemical Industry Press, Beijing (2012). 8th edition of the original work
Zhang, F.: Material Properties. Shanghai Jiaotong University Press, Shanghai (2014)
Powell, R.W.: Correlation of metallic thermal and electrical conductivities for both solid and liquid phases. Int. J. Heat Mass Transf. 8(7), 1033–1045 (1965)
Lumley, R.N., Deeva, N., Larsen, R., et al.: The role of alloy composition and T7 heat treatment in enhancing thermal conductivity of aluminum high pressure diecastings. Metall. Mater. Trans. A 44(2), 1074–1086 (2013)
Karabay, S.: Influence of AlB2 compound on elimination of incoherent precipitation in artificial aging of wires drawn from redraw rod extruded from billets cast of alloy AA-6101 by vertical direct chill casting. Mater. Des. 29(7), 1364–1375 (2008)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Science Press
About this paper
Cite this paper
Liu, J., Wu, S., Zheng, J. (2020). Microstructure and Properties of Semi-solid Die Casting of High Silicon Aluminum Alloy with High Thermal Conductivity. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_47
Download citation
DOI: https://doi.org/10.1007/978-981-32-9441-7_47
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-32-9440-0
Online ISBN: 978-981-32-9441-7
eBook Packages: Intelligent Technologies and RoboticsIntelligent Technologies and Robotics (R0)