Abstract
Electrochemical additive manufacturing (ECAM) is a novel process which uses localized electrochemical deposition as the material addition mechanism for additive manufacturing (AM) of metal parts at room temperature. While ECAM possesses highly controllable process parameters, complex electrochemical phenomena, such as nucleation patterns and hydrogen codeposition, may cause residual stresses in the output parts. To better predict this behavior for increased reliability and future commercial adoption of ECAM, localized deposits were studied under several controlled combinations of electrochemical process parameters under both constant-time and constant-height termination criteria. The residual stress was then measured using an atomic force microscopy (AFM) indentation procedure. Significant trends that were found include increased stress magnitude with increasing applied voltage, and the higher influence of voltage and then pulse period on the resulting stress, compared to the duty cycle. It was also seen that shorter deposition times led to compressive stresses and longer times led to tensile stresses.
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References
Kruth, J.P., Froyen, L., Van Vaerenbergh, J., Mercelis, P., Rombouts, M., Lauwers, B.: Selective laser melting of iron-based powder. J. Mater. Process. Technol. 149(1–3), 616–622 (2004)
Sundaram, M.M., Kamaraj, A.B., Kumar, V.S.: Mask-less electrochemical additive manufacturing: a feasibility study. J. Manuf. Sci. Eng. 137(2), 021006 (2015)
Kamaraj, A.B., Sundaram, M.: A study on the effect of inter-electrode gap and pulse voltage on current density in electrochemical additive manufacturing. J. Appl. Electrochem. 48(4), 463–469 (2018)
Bard, A.J., Huesser, O.E., Craston, D.H.: High resolution deposition and etching in polymer films. United States Patent No. 4,968,390 (1990)
Chan, K.C., Qu, N.S., Zhu, D.: Effect of reverse pulse current on the internal stress of electroformed nickel. J. Mater. Process. Technol. 63(1–3), 819–822 (1997)
Basrour, S., Robert, L.: X-ray characterization of residual stresses in electroplated nickel used in LIGA technique. Mater. Sci. Eng. A 288(2), 270–274 (2000)
Song, C., Du, L., Zhao, W., Zhu, H., Zhao, W., Wang, W.: Effectiveness of stress release geometries on reducing residual stress in electroforming metal microstructure. J. Micromech. Microeng. 28(4), 045010 (2018)
Kume, T., Egawa, S., Yamaguchi, G., Mimura, H.: Influence of residual stress of electrodeposited layer on shape replication accuracy in Ni electroforming. Procedia CIRP 42, 783–787 (2016)
Daryadel, S., Behroozfar, A., Morsali, S.R., Moreno, S., Baniasadi, M., Bykova, J., Bernal, R.A., Minary-Jolandan, M.: Localized pulsed electrodeposition process for three-dimensional printing of nanotwinned metallic nanostructures. Nano Lett. 18(1), 208–214 (2018)
Suresh, S., Giannakopoulos, A.: A new method for estimating residual stresses by instrumented sharp indentation. Acta Mater. 46(16), 5755–5767 (1998)
Li, X., Bhushan, B.: A review of nanoindentation continuous stiffness measurement technique and its applications. Mater. Charact. 48(1), 11–36 (2002)
Kilinc, Y., Unal, U., Alaca, B.E.: Residual stress gradients in electroplated nickel thin films. Microelectron. Eng. 134, 60–67 (2015)
Marro, J.B., Darroudi, T., Okoro, C.A., Obeng, Y.S., Richardson, K.C.: The influence of pulsed electroplating frequency and duty cycle on copper film microstructure and stress state. Thin Solid Films 621, 91 (2017)
Lee, W., Lee, S., Kim, B., Kim, H.: Relief of residual stress of electrodeposited nickel by amine as additive in sulfamate electrolyte. Mater. Lett. 198, 54–56 (2017)
Kao, L.C., Hsu, L.H., Brahma, S., Huang, B.C., Liu, C.C., Lo, K.Y.: Stabilized copper plating method by programmed electroplated current: accumulation of densely packed copper grains in the interconnect. Appl. Surf. Sci. 388, 228–233 (2016)
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Financial support provided by the National Science Foundation under Grant Nos. CMMI–1454181 and CMMI–1400800 is acknowledged.
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Brant, A., Kamaraj, A., Sundaram, M. (2020). Study of Residual Stress in Nickel Micro Parts Made by Electrochemical Additive Manufacturing. In: Shunmugam, M., Kanthababu, M. (eds) Advances in Additive Manufacturing and Joining. Lecture Notes on Multidisciplinary Industrial Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-32-9433-2_9
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DOI: https://doi.org/10.1007/978-981-32-9433-2_9
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